Environmental degradation of YBa2Cu3O7 − x thin films. Analysis by atomic force microscopy

Abstract

YBa2Cu3O7 − x thin films deposited on polished MgO substrates have been exposed to dry and wet steam at 65°C for periods up to 120 min. The resultant degradation of the film and the substrate has been studied by atomic force microscopy. It was found that wet steam was much more aggressive than dry steam, and that there was a synergistic relationship between the film and the substrate. The early stages of degradation of the film can be described adequately by the prevailing model based on observations on bulk specimens.