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  • Mechanical Analysis of Condenser Microphone Based on Silicon Carbide Diaphragm for Sonic Detection

    Author(s)
    Zawawi, Siti Aisyah
    Hamzah, Azrul Azlan
    Majlis, Burhanuddin Yeop
    Mohd-Yasin, Faisal
    Griffith University Author(s)
    Mohd-Yasin, Faisal
    Year published
    2016
    Metadata
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    Abstract
    A new design of microelectromechanical systems (MEMS) condenser microphone employing silicon carbide (SiC) diaphragm is proposed for the sonic detection. The sensing structure consists of SiC thin film as the top plate and perforated Si as the back plate. The numerical analysis and simulation studies compare the mechanical performances of the square-shape SiC diaphragm. Four parameters are considered i.e. resonance frequency, cutoff frequency, maximum deflection and maximum stress. The theoretical and simulated results match closely. Overall, the 680 μm × 680 μm SiC diaphragm with the thickness of 1.00 μm gives the optimized ...
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    A new design of microelectromechanical systems (MEMS) condenser microphone employing silicon carbide (SiC) diaphragm is proposed for the sonic detection. The sensing structure consists of SiC thin film as the top plate and perforated Si as the back plate. The numerical analysis and simulation studies compare the mechanical performances of the square-shape SiC diaphragm. Four parameters are considered i.e. resonance frequency, cutoff frequency, maximum deflection and maximum stress. The theoretical and simulated results match closely. Overall, the 680 μm × 680 μm SiC diaphragm with the thickness of 1.00 μm gives the optimized mechanical performances for the sonic detection.
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    Conference Title
    2016 IEEE INTERNATIONAL CONFERENCE ON SEMICONDUCTOR ELECTRONICS (ICSE) PROCEEDINGS
    Volume
    2016-September
    DOI
    https://doi.org/10.1109/SMELEC.2016.7573582
    Subject
    Electronics, sensors and digital hardware not elsewhere classified
    Publication URI
    http://hdl.handle.net/10072/123940
    Collection
    • Conference outputs

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