Mechanical Analysis of Condenser Microphone Based on Silicon Carbide Diaphragm for Sonic Detection
Author(s)
Zawawi, Siti Aisyah
Hamzah, Azrul Azlan
Majlis, Burhanuddin Yeop
Mohd-Yasin, Faisal
Griffith University Author(s)
Year published
2016
Metadata
Show full item recordAbstract
A new design of microelectromechanical systems (MEMS) condenser microphone employing silicon carbide (SiC) diaphragm is proposed for the sonic detection. The sensing structure consists of SiC thin film as the top plate and perforated Si as the back plate. The numerical analysis and simulation studies compare the mechanical performances of the square-shape SiC diaphragm. Four parameters are considered i.e. resonance frequency, cutoff frequency, maximum deflection and maximum stress. The theoretical and simulated results match closely. Overall, the 680 μm × 680 μm SiC diaphragm with the thickness of 1.00 μm gives the optimized ...
View more >A new design of microelectromechanical systems (MEMS) condenser microphone employing silicon carbide (SiC) diaphragm is proposed for the sonic detection. The sensing structure consists of SiC thin film as the top plate and perforated Si as the back plate. The numerical analysis and simulation studies compare the mechanical performances of the square-shape SiC diaphragm. Four parameters are considered i.e. resonance frequency, cutoff frequency, maximum deflection and maximum stress. The theoretical and simulated results match closely. Overall, the 680 μm × 680 μm SiC diaphragm with the thickness of 1.00 μm gives the optimized mechanical performances for the sonic detection.
View less >
View more >A new design of microelectromechanical systems (MEMS) condenser microphone employing silicon carbide (SiC) diaphragm is proposed for the sonic detection. The sensing structure consists of SiC thin film as the top plate and perforated Si as the back plate. The numerical analysis and simulation studies compare the mechanical performances of the square-shape SiC diaphragm. Four parameters are considered i.e. resonance frequency, cutoff frequency, maximum deflection and maximum stress. The theoretical and simulated results match closely. Overall, the 680 μm × 680 μm SiC diaphragm with the thickness of 1.00 μm gives the optimized mechanical performances for the sonic detection.
View less >
Conference Title
2016 IEEE INTERNATIONAL CONFERENCE ON SEMICONDUCTOR ELECTRONICS (ICSE) PROCEEDINGS
Volume
2016-September
Subject
Electronics, sensors and digital hardware not elsewhere classified