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dc.contributor.authorMarsi, Noraini
dc.contributor.authorMajlis, Burhanuddin Yeop
dc.contributor.authorHamzah, Azrul Azlan
dc.contributor.authorAbidin, Hafzaliza Erny Zainal
dc.contributor.authorMohd-Yasin, Faisal
dc.date.accessioned2018-07-19T12:30:27Z
dc.date.available2018-07-19T12:30:27Z
dc.date.issued2015
dc.identifier.isbn9781479985500
dc.identifier.doi10.1109/RSM.2015.7354962
dc.identifier.urihttp://hdl.handle.net/10072/125412
dc.description.abstractAbstract: This paper reports a packaged MEMS capacitive pressure sensor based 3C-SiC using bulk-micromachining technology that operates on the pressure up to 5.0 MPa and temperature up to 500 oC. The diaphragm employs a single-crystal 3C-SiC thin film that is back-etched from its Si substrate. A photosensitive ProTEK PSB is used as a protection mask layer to reduce the process steps. We compare our results with similar work that also employs a single-crystal 3C-SiC-on-Si capacitive pressure sensor with ceramic package. The MEMS capacitive pressure sensor is employed with 3C-SiC that was performed using hot wall low pressure chemical vapor deposition (LPCVD) reactors at the Queensland Micro and Nanotechnology Center (QMNC), Griffith University. This paper also focuses on comparing those two highest efficiency distributions in MEMS capacitive pressure sensor device to other types of MEMS capacitive pressure sensor. Different temperature, hysteresis and repeatability tests are presented to demonstrate the functionality of the packaged MEMS capacitive pressure sensor. As expected, the output hysteresis has low hysteresis (less than 0.05%) which has inflexibility greater than traditional silicon. By utilizing this low hysteresis was revealed the packaged MEMS capacitive pressure sensor has high repeatability and stability of the sensor.
dc.description.peerreviewedYes
dc.languageEnglish
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.publisher.placeUnited States
dc.relation.ispartofconferencenameIEEE Regional Symposium on Micro and Nanoelectronics (RSM)
dc.relation.ispartofconferencetitle2015 IEEE REGIONAL SYMPOSIUM ON MICRO AND NANOELECTRONICS (RSM)
dc.relation.ispartofdatefrom2015-08-19
dc.relation.ispartofdateto2015-08-21
dc.relation.ispartoflocationKuala Terengganu, MALAYSIA
dc.relation.ispartofpagefrom49
dc.relation.ispartofpageto52
dc.subject.fieldofresearchMicroelectromechanical Systems (MEMS)
dc.subject.fieldofresearchMicroelectronics and Integrated Circuits
dc.subject.fieldofresearchcode091306
dc.subject.fieldofresearchcode090604
dc.title3C-SiC-on-Si Based MEMS Packaged Capacitive Pressure Sensor Operating up to 500 ꃠand 5 MPa
dc.typeConference output
dc.type.descriptionE1 - Conferences
dc.type.codeE - Conference Publications
gro.hasfulltextNo Full Text
gro.griffith.authorMohd-Yasin, Faisal


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    Contains papers delivered by Griffith authors at national and international conferences.

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