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  • MEMS-based tunable meander inductor

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    KhanPUB2383.pdf (8.252Mb)
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    Accepted Manuscript (AM)
    Author(s)
    Khan, F
    Zhu, Y
    Lu, J
    Pal, J
    Griffith University Author(s)
    Lu, Junwei
    Zhu, Yong
    Year published
    2015
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    Abstract
    novel MEMS-based tunable meander inductor is reported. The inductor is fabricated using a single metal layer in a low-cost commercially available Metal-MUMPs™ process. The mutual inductance of the meander inductor is tuned by changing the gaps between the meander turns using a chevron-type thermal actuator. An air trench underneath the inductor has been made to reduce the loss in the silicon substrate and improve quality factor (Q-factor). Tuning range of ∼50.8% and maximum Q-factor of 8.17 have been achieved at 5.79 GHz by stretching the meander inductor for 22 µm. The total footprint of the device is 0.58 mm2.novel MEMS-based tunable meander inductor is reported. The inductor is fabricated using a single metal layer in a low-cost commercially available Metal-MUMPs™ process. The mutual inductance of the meander inductor is tuned by changing the gaps between the meander turns using a chevron-type thermal actuator. An air trench underneath the inductor has been made to reduce the loss in the silicon substrate and improve quality factor (Q-factor). Tuning range of ∼50.8% and maximum Q-factor of 8.17 have been achieved at 5.79 GHz by stretching the meander inductor for 22 µm. The total footprint of the device is 0.58 mm2.
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    Journal Title
    Electronics Letters
    Volume
    51
    Issue
    20
    DOI
    https://doi.org/10.1049/el.2015.2495
    Copyright Statement
    © 2015 IET. This paper is a postprint of a paper submitted to and accepted for publication in Electronics Letters and is subject to Institution of Engineering and Technology Copyright. The copy of record is available at IET Digital Library
    Subject
    Electrical energy generation (incl. renewables, excl. photovoltaics)
    Communications engineering
    Publication URI
    http://hdl.handle.net/10072/142016
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    • Journal articles

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