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  • The Mechanical Characterization of Bending Test for MEMS Capacitive Pressure Sensor Based 3C-SiC in High Temperature

    Author(s)
    Marsi, Noraini
    Majlis, Burhanuddin Yeop
    Hamzah, Azrul Azlan
    Mohd-Yasin, Faisal
    Griffith University Author(s)
    Mohd-Yasin, Faisal
    Year published
    2015
    Metadata
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    Abstract
    This paper reports the mechanical analysis of bending test for Si and 3C-SiC materials. The analytical experimental were determined by using a standard three-point micro-bend test method (ASTM E290) to be applied on MEMS capacitive pressure sensor diaphragm. The MEMS device was fabricated into 5.0 mm x 5.0 mm square shape with the thicknesses of 680 μm and 1.0 μm thin film on 3C-SiC-on-Si wafer. The bending test is performed to determine the maximum stress during heat treatment up to 1000 °C and the load is applied until the 3C-SiC-on-Si wafer fracture. The test results indicated that 3C-SiC has good fatigue properties when ...
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    This paper reports the mechanical analysis of bending test for Si and 3C-SiC materials. The analytical experimental were determined by using a standard three-point micro-bend test method (ASTM E290) to be applied on MEMS capacitive pressure sensor diaphragm. The MEMS device was fabricated into 5.0 mm x 5.0 mm square shape with the thicknesses of 680 μm and 1.0 μm thin film on 3C-SiC-on-Si wafer. The bending test is performed to determine the maximum stress during heat treatment up to 1000 °C and the load is applied until the 3C-SiC-on-Si wafer fracture. The test results indicated that 3C-SiC has good fatigue properties when heated up to 1000 °C with the maximum load of 52.72 N directly bring out the maximum stress and maximum strain of 104.95 MPa and 3.2%, respectively. This approach can be compared to Si, the material no longer withstand with the maximum load is 1.30 N only with the maximum stress is 10.13 MPa and maximum stain is 1.0%
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    Journal Title
    Applied Mechanics and Materials
    Volume
    754-755
    DOI
    https://doi.org/10.4028/www.scientific.net/AMM.754-755.602
    Subject
    Microelectronics and Integrated Circuits
    Microelectromechanical Systems (MEMS)
    Engineering
    Publication URI
    http://hdl.handle.net/10072/163340
    Collection
    • Journal articles

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