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dc.contributor.authorMarsi, Noraini
dc.contributor.authorMajlis, Burhanuddin Yeop
dc.contributor.authorHamzah, Azrul Azlan
dc.contributor.authorMohd-Yasin, Faisal
dc.contributor.editorBakar, RBA
dc.contributor.editorFroome, C
dc.date.accessioned2017-09-06T23:15:17Z
dc.date.available2017-09-06T23:15:17Z
dc.date.issued2015
dc.identifier.issn1876-6102
dc.identifier.doi10.1016/j.egypro.2015.03.279
dc.identifier.urihttp://hdl.handle.net/10072/163345
dc.description.abstractThis study develops the prototype of a micro-electro-mechanical systems (MEMS) packaged capacitive pressure sensor employing 3C-SiC diaphragm for high temperature devices. The 3C-SiC diaphragm is designed with the thicknesses of 1.0 μm and the width and length of 2.0 mm x 2.0 mm. The fabricated sensor is combined with a reliable stainless steel o-ring packaging concept as a simple assembly approach to reduce the manufacturing cost. There is an o-ring seal at the sensor devices an advantageous for high reliability, small size, lightweight, smart interface features and easy maintenance services. The stability and performance of the prototype devices has been tested for three test group and measured by using LCR meter. The prototypes of MEMS capacitive pressure sensor are characterized under static pressure of 5.0 MPa and temperatures up to 500 °C in a stainless steel chamber with direct capacitance measurement. At room temperature (27 °C), the sensitivity of the sensor is 0.0096 pF/MPa in the range of pressure (1.0–5.0 MPa), with nonlinearity of 0.49%. At 300 °C, the sensitivity is 0.0127 pF/MPa, and the nonlinearity of 0.46%. The sensitivity increased by 0.0031 pF/MPa; corresponding temperature coefficient of sensitivity is 0.058%/°C. At 500 °C, the maximum temperature coefficient of output change is 0.073%/°C being measured at 5.0 MPa. The main impact of this work is the ability of the sensor to operate up to 500 °C, compare to the previous work using similar 3C-SiC diaphragm that can operates only 300 °C. The results also show that MEMS packaged capacitive pressure sensor employing 3C-SiC is performed high reliability for high temperature up to 500 °C. In addition, a reliable stainless steel o-ring packaging concept of MEMS packaged capacitive pressure sensor.
dc.description.peerreviewedYes
dc.languageEnglish
dc.language.isoeng
dc.publisherElsevier
dc.publisher.placeNetherlands
dc.relation.ispartofpagefrom471
dc.relation.ispartofpageto479
dc.relation.ispartofjournalEnergy Procedia
dc.relation.ispartofvolume68
dc.subject.fieldofresearchChemical engineering
dc.subject.fieldofresearchMicroelectronics
dc.subject.fieldofresearchMicroelectromechanical systems (MEMS)
dc.subject.fieldofresearchcode4004
dc.subject.fieldofresearchcode400908
dc.subject.fieldofresearchcode401705
dc.titleHigh Reliability of MEMS Packaged Capacitive Pressure Sensor Employing 3C-SiC for High temperature
dc.typeJournal article
dc.type.descriptionC1 - Articles
dc.type.codeC - Journal Articles
dcterms.licensehttp://creativecommons.org/licenses/by-nc-nd/4.0/
dc.description.versionVersion of Record (VoR)
gro.rights.copyright© 2015 The Authors. Published by Elsevier LtdThis is an Open Access article distributed under the terms of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International (CC BY-NC-ND 4.0) License (http://creativecommons.org/licenses/by-nc-nd/4.0/) which permits unrestricted, non-commercial use, distribution and reproduction in any medium, providing that the work is properly cited. You may not alter, transform, or build upon this work.
gro.hasfulltextFull Text
gro.griffith.authorMohd-Yasin, Faisal


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