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  • Comparative Analysis of Intel Pentium 4 and IEEE/EMC TC-9/ACEM CPU Heat Sinks

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    Author(s)
    Lu, J
    Duan, X
    Griffith University Author(s)
    Lu, Junwei
    Year published
    2007
    Metadata
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    Abstract
    This paper presents finite element frequency domain results for electromagnetic radiation emitted from high power microelectronic circuits connected to a heat sink. The heat sink model associated with one of the IEEE EMC TC-9 challenging problems, 2000-4 CPU heat sink, has been used to investigate different grounding configurations. A new simulation model for the Intel P4 CPU heat sink is proposed. In contrast to the 2000-4 EMC challenging model, Intel P4 CPU heat sink model exhibited different results. A resonant frequency of 2.6 GHz with a reflection coefficient of 8.3dB was found for the Intel P4 CPU heat sink, which is ...
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    This paper presents finite element frequency domain results for electromagnetic radiation emitted from high power microelectronic circuits connected to a heat sink. The heat sink model associated with one of the IEEE EMC TC-9 challenging problems, 2000-4 CPU heat sink, has been used to investigate different grounding configurations. A new simulation model for the Intel P4 CPU heat sink is proposed. In contrast to the 2000-4 EMC challenging model, Intel P4 CPU heat sink model exhibited different results. A resonant frequency of 2.6 GHz with a reflection coefficient of 8.3dB was found for the Intel P4 CPU heat sink, which is close to the operating frequency of 2.4GHz for IEEE and Bluetooth wireless communication systems. The comparison of frequency sweeping results shows that the reflection coefficient was found to be -16dB at 3.6GHz and -20dB at 3.4GHz from conventional CPU heat sink. The CPU heat sink can perform as an efficient radiator at these frequencies.
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    Conference Title
    IEEE International Symposium on Electromagnetic Compatibility
    Publisher URI
    http://www.ieee.org/portal/site
    DOI
    https://doi.org/10.1109/ISEMC.2007.86
    Copyright Statement
    © 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
    Publication URI
    http://hdl.handle.net/10072/17932
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    • Conference outputs

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