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dc.contributor.authorLu, Junweien_US
dc.contributor.authorDuan, Xiaoen_US
dc.contributor.editorJanet O'Neilen_US
dc.date.accessioned2017-05-03T12:14:08Z
dc.date.available2017-05-03T12:14:08Z
dc.date.issued2007en_US
dc.date.modified2008-05-26T02:08:32Z
dc.identifier.refuriwww.emc2007.orgen_AU
dc.identifier.doi10.1109/ISEMC.2007.86en_AU
dc.identifier.urihttp://hdl.handle.net/10072/17932
dc.description.abstractThis paper presents finite element frequency domain results for electromagnetic radiation emitted from high power microelectronic circuits connected to a heat sink. The heat sink model associated with one of the IEEE EMC TC-9 challenging problems, 2000-4 CPU heat sink, has been used to investigate different grounding configurations. A new simulation model for the Intel P4 CPU heat sink is proposed. In contrast to the 2000-4 EMC challenging model, Intel P4 CPU heat sink model exhibited different results. A resonant frequency of 2.6 GHz with a reflection coefficient of 8.3dB was found for the Intel P4 CPU heat sink, which is close to the operating frequency of 2.4GHz for IEEE and Bluetooth wireless communication systems. The comparison of frequency sweeping results shows that the reflection coefficient was found to be -16dB at 3.6GHz and -20dB at 3.4GHz from conventional CPU heat sink. The CPU heat sink can perform as an efficient radiator at these frequencies.en_US
dc.description.peerreviewedYesen_US
dc.description.publicationstatusYesen_AU
dc.format.extent844245 bytes
dc.format.mimetypeapplication/pdf
dc.languageEnglishen_US
dc.language.isoen_AU
dc.publisherThe Institute of Electrical and Electronics Engineers Inc.en_US
dc.publisher.placeUSAen_US
dc.publisher.urihttp://www.ieee.org/portal/siteen_AU
dc.relation.ispartofstudentpublicationNen_AU
dc.relation.ispartofconferencename2007 IEEE International Symposium on Electromagnetic Compatibility (EMC 2007)en_US
dc.relation.ispartofconferencetitle2007 IEEE International Symposium on Electromagnetic Compatibility (Proceedings)en_US
dc.relation.ispartofdatefrom2007-07-08en_US
dc.relation.ispartofdateto2007-07-13en_US
dc.relation.ispartoflocationHonolulu, Hawaiien_US
dc.rights.retentionYen_AU
dc.subject.fieldofresearchcode290901en_US
dc.titleComparative Analysis of Intel Pentium 4 and IEEE/EMC TC-9/ACEM CPU Heat Sinksen_US
dc.typeConference outputen_US
dc.type.descriptionE1 - Conference Publications (HERDC)en_US
dc.type.codeE - Conference Publicationsen_US
gro.facultyGriffith Sciences, Griffith School of Engineeringen_US
gro.rights.copyrightCopyright 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.en_AU
gro.date.issued2007
gro.hasfulltextFull Text


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    Contains papers delivered by Griffith authors at national and international conferences.

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