The Effect of Dynamic Design Processing for Yield Enhancement in the Fabrication of Deep Sub-Micron MOSFET's
Abstract
With the downscaling of microelectronic devices, tighter process control and more elaborate fabrication equipment need to be complemented by process correcting techniques if good quality and high yields are to be expected. Dynamic Design processing-a forward correcting technique by which some recipe values are recalculated during manufacturing-is such a technique. In this paper the effect of Dynamic Design Processing on deep sub-micron MOSFET's is presented. The results show that a parametric yield improvement in excess of 25%) over conventional manufacturing can be achieved.
Journal Title
IEEE Transactions on Semiconductor Manufacturing
Volume
7
Issue
1
Publisher URI
Copyright Statement
© 1994 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Subject
Agricultural, veterinary and food sciences
Manufacturing engineering