Step-wise analysis of the dental implant insertion process using the finite element technique
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Objectives: Using the finite element method (FEM), the insertion process of a dental implant into a section of the human mandible is analysed. The ultimate aim of this article is to advance the use of an innovative engineering approach in dental practices, especially in the process of dental implantation. Material and methods: The FEM and analysis techniques are used to replicate and evaluate the stress profile created within the mandible during the implantation process Results: The von Mises stress profiles in both cancellous and cortical bone are examined during implant insertion. The applied torque and the insertion stage are found to strongly influence the resulting stress profile within the surrounding jawbone. Conclusions: Through the combination of both dental and engineering expertise, a simplified and efficient modeling technique is developed. This improves the understanding of the biomechanical reaction that the jawbone exhibits due to the insertion of implant. The current research is a pilot study using the FEM to model and simulate the dental implantation process. The assumptions made in the modeling and simulation process are: (1) the implantation process is simulated as a step-wise process instead of a continuous process; (2) the implant is parallel threaded and the implant does not rotate during insertion into the jawbone. Although the modeling and simulation techniques had to be simplified, a significant amount of information is gained that helps lay a good foundation for future research. Recommendations for future studies include the variation of the torque applied during the implantation process and upgrading the software capabilities to simulate the full dynamical process of implantation.
Clinical Oral Implants Research
Copyright 2008 Wiley-Blackwell Publishing. This is the author-manuscript version of the paper. Reproduced in accordance with the copyright policy of the publisher. The definitive version is available at www.interscience.wiley.com