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  • Current mechanisms in n-SiC/p-Si heterojunctions

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    55948_1.pdf (98.84Kb)
    Author(s)
    Tanner, Philip
    Dimitrijev, Sima
    Harrison, H Barry
    Griffith University Author(s)
    Harrison, Barry B.
    Dimitrijev, Sima
    Tanner, Philip G.
    Year published
    2008
    Metadata
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    Abstract
    Current-voltage characteristics of 3C-SiC/Si heterojunction diodes are presented with reverse breakdown voltage exceeding 200V, leakage current of 1.3mAcm-2 at 200V, and a +/-1V rectification ratio of 200,000. The reverse leakage current was observed to have both temperature and field dependence and hence a model is presented to explain this observation based on a trap assisted tunneling-thermal emission mechanism located at the SiC/Si interface. With further improvements in the SiC crystal quality at the silicon interface, trap concentrations and thus reverse bias leakage currents will be reduced.Current-voltage characteristics of 3C-SiC/Si heterojunction diodes are presented with reverse breakdown voltage exceeding 200V, leakage current of 1.3mAcm-2 at 200V, and a +/-1V rectification ratio of 200,000. The reverse leakage current was observed to have both temperature and field dependence and hence a model is presented to explain this observation based on a trap assisted tunneling-thermal emission mechanism located at the SiC/Si interface. With further improvements in the SiC crystal quality at the silicon interface, trap concentrations and thus reverse bias leakage currents will be reduced.
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    Conference Title
    COMMAD: 2008 CONFERENCE ON OPTOELECTRONIC AND MICROELECTRONIC MATERIALS & DEVICES
    Publisher URI
    http://ieeexplore.ieee.org/servlet/opac?punumber=4799764
    DOI
    https://doi.org/10.1109/COMMAD.2008.4802088
    Copyright Statement
    © 2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
    Subject
    Microelectronics
    Publication URI
    http://hdl.handle.net/10072/27865
    Collection
    • Conference outputs

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