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  • Plastic circuit reliability and design for recycling

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    59139_1.pdf (497.0Kb)
    Author(s)
    Thiel, David V
    Neeli, Madhusudanrao
    Raj, Sundra
    Griffith University Author(s)
    Thiel, David V.
    Neeli, Madhu
    Year published
    2009
    Metadata
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    Abstract
    Electronics is a major contributor to solid waste streams around the world. The manufacturing and the recycling processes currently used in the electronics industry are energy intensive and are accompanied by noxious gaseous and liquid waste. Circuits in Plastic (CiP) is a new technology designed to address issues. Circuit components are placed in a plastic substrate, conductive tracks are screen printed and the completed completed by thermally binding a cover sheet of the same material. The circuits are disassembled by mechanical means. While the process requires much less energy and produces minimal waste, the ...
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    Electronics is a major contributor to solid waste streams around the world. The manufacturing and the recycling processes currently used in the electronics industry are energy intensive and are accompanied by noxious gaseous and liquid waste. Circuits in Plastic (CiP) is a new technology designed to address issues. Circuit components are placed in a plastic substrate, conductive tracks are screen printed and the completed completed by thermally binding a cover sheet of the same material. The circuits are disassembled by mechanical means. While the process requires much less energy and produces minimal waste, the process must be reliable. Mechanical experiments and thermal modeling have supported the viability of the technology. Microcontroller circuits manufactured in this way have remained functional over 4 years and a water proof and mechanically reliable.
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    Conference Title
    2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009)
    DOI
    https://doi.org/10.1109/EPTC.2009.5416425
    Copyright Statement
    © 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
    Subject
    Environmental Engineering Design
    Circuits and Systems
    Publication URI
    http://hdl.handle.net/10072/29966
    Collection
    • Conference outputs

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