dc.contributor.convenor | James HOW | |
dc.contributor.author | Thiel, David V | |
dc.contributor.author | Neeli, Madhusudanrao | |
dc.contributor.author | Raj, Sundra | |
dc.contributor.editor | Yoon, S.Y. | |
dc.date.accessioned | 2017-05-03T11:03:46Z | |
dc.date.available | 2017-05-03T11:03:46Z | |
dc.date.issued | 2009 | |
dc.date.modified | 2010-06-02T09:46:41Z | |
dc.identifier.isbn | 978-1-4244-5099-2 | |
dc.identifier.doi | 10.1109/EPTC.2009.5416425 | |
dc.identifier.uri | http://hdl.handle.net/10072/29966 | |
dc.description.abstract | Electronics is a major contributor to solid waste streams around the world. The manufacturing and the recycling processes currently used in the electronics industry are energy intensive and are accompanied by noxious gaseous and liquid waste. Circuits in Plastic (CiP) is a new technology designed to address issues. Circuit components are placed in a plastic substrate, conductive tracks are screen printed and the completed completed by thermally binding a cover sheet of the same material. The circuits are disassembled by mechanical means. While the process requires much less energy and produces minimal waste, the process must be reliable. Mechanical experiments and thermal modeling have supported the viability of the technology. Microcontroller circuits manufactured in this way have remained functional over 4 years and a water proof and mechanically reliable. | |
dc.description.peerreviewed | Yes | |
dc.description.publicationstatus | Yes | |
dc.format.extent | 509000 bytes | |
dc.format.mimetype | application/pdf | |
dc.language | English | |
dc.language.iso | eng | |
dc.publisher | IEEE Press | |
dc.publisher.place | Piscataway, N.J. USA | |
dc.relation.ispartofstudentpublication | N | |
dc.relation.ispartofconferencename | 11th Electronics Packaging Technology Conference | |
dc.relation.ispartofconferencetitle | 2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009) | |
dc.relation.ispartofdatefrom | 2009-12-09 | |
dc.relation.ispartofdateto | 2009-12-11 | |
dc.relation.ispartoflocation | Shangri La, SINGAPORE | |
dc.relation.ispartofpagefrom | 858 | |
dc.relation.ispartofpagefrom | 2 pages | |
dc.relation.ispartofpageto | + | |
dc.relation.ispartofpageto | 2 pages | |
dc.rights.retention | Y | |
dc.subject.fieldofresearch | Circuits and systems | |
dc.subject.fieldofresearchcode | 400801 | |
dc.title | Plastic circuit reliability and design for recycling | |
dc.type | Conference output | |
dc.type.description | E1 - Conferences | |
dc.type.code | E - Conference Publications | |
gro.faculty | Griffith Sciences, Griffith School of Engineering | |
gro.rights.copyright | © 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. | |
gro.date.issued | 2009 | |
gro.hasfulltext | Full Text | |
gro.griffith.author | Thiel, David V. | |