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dc.contributor.convenorJames HOW
dc.contributor.authorThiel, David V
dc.contributor.authorNeeli, Madhusudanrao
dc.contributor.authorRaj, Sundra
dc.contributor.editorYoon, S.Y.
dc.date.accessioned2017-05-03T11:03:46Z
dc.date.available2017-05-03T11:03:46Z
dc.date.issued2009
dc.date.modified2010-06-02T09:46:41Z
dc.identifier.isbn978-1-4244-5099-2
dc.identifier.doi10.1109/EPTC.2009.5416425
dc.identifier.urihttp://hdl.handle.net/10072/29966
dc.description.abstractElectronics is a major contributor to solid waste streams around the world. The manufacturing and the recycling processes currently used in the electronics industry are energy intensive and are accompanied by noxious gaseous and liquid waste. Circuits in Plastic (CiP) is a new technology designed to address issues. Circuit components are placed in a plastic substrate, conductive tracks are screen printed and the completed completed by thermally binding a cover sheet of the same material. The circuits are disassembled by mechanical means. While the process requires much less energy and produces minimal waste, the process must be reliable. Mechanical experiments and thermal modeling have supported the viability of the technology. Microcontroller circuits manufactured in this way have remained functional over 4 years and a water proof and mechanically reliable.
dc.description.peerreviewedYes
dc.description.publicationstatusYes
dc.format.extent509000 bytes
dc.format.mimetypeapplication/pdf
dc.languageEnglish
dc.language.isoeng
dc.publisherIEEE Press
dc.publisher.placePiscataway, N.J. USA
dc.relation.ispartofstudentpublicationN
dc.relation.ispartofconferencename11th Electronics Packaging Technology Conference
dc.relation.ispartofconferencetitle2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009)
dc.relation.ispartofdatefrom2009-12-09
dc.relation.ispartofdateto2009-12-11
dc.relation.ispartoflocationShangri La, SINGAPORE
dc.relation.ispartofpagefrom858
dc.relation.ispartofpagefrom2 pages
dc.relation.ispartofpageto+
dc.relation.ispartofpageto2 pages
dc.rights.retentionY
dc.subject.fieldofresearchCircuits and systems
dc.subject.fieldofresearchcode400801
dc.titlePlastic circuit reliability and design for recycling
dc.typeConference output
dc.type.descriptionE1 - Conferences
dc.type.codeE - Conference Publications
gro.facultyGriffith Sciences, Griffith School of Engineering
gro.rights.copyright© 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
gro.date.issued2009
gro.hasfulltextFull Text
gro.griffith.authorThiel, David V.


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    Contains papers delivered by Griffith authors at national and international conferences.

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