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dc.contributor.convenorJames HOWen_AU
dc.contributor.authorNeeli, Madhuen_US
dc.contributor.authorRaj, Sundraen_US
dc.contributor.authorThiel, Daviden_US
dc.contributor.editorYoon, S.Y.en_US
dc.date.accessioned2017-04-04T14:09:42Z
dc.date.available2017-04-04T14:09:42Z
dc.date.issued2009en_US
dc.date.modified2010-06-02T09:46:41Z
dc.identifier.doi10.1109/EPTC.2009.5416425en_AU
dc.identifier.urihttp://hdl.handle.net/10072/29966
dc.description.abstractElectronics is a major contributor to solid waste streams around the world. The manufacturing and the recycling processes currently used in the electronics industry are energy intensive and are accompanied by noxious gaseous and liquid waste. Circuits in Plastic (CiP) is a new technology designed to address issues. Circuit components are placed in a plastic substrate, conductive tracks are screen printed and the completed completed by thermally binding a cover sheet of the same material. The circuits are disassembled by mechanical means. While the process requires much less energy and produces minimal waste, the process must be reliable. Mechanical experiments and thermal modeling have supported the viability of the technology. Microcontroller circuits manufactured in this way have remained functional over 4 years and a water proof and mechanically reliable.en_US
dc.description.peerreviewedYesen_US
dc.description.publicationstatusYesen_AU
dc.format.extent509000 bytes
dc.format.mimetypeapplication/pdf
dc.languageEnglishen_US
dc.language.isoen_AU
dc.publisherIEEE Pressen_US
dc.publisher.placePiscataway, N.J. USAen_US
dc.relation.ispartofstudentpublicationNen_AU
dc.relation.ispartofconferencename11th Electronic Packaging Technology Conference 2009en_US
dc.relation.ispartofconferencetitleElectronics Packaging Technology Conferenceen_US
dc.relation.ispartofdatefrom2009-12-09en_US
dc.relation.ispartofdateto2009-12-11en_US
dc.relation.ispartoflocationSingaporeen_US
dc.rights.retentionYen_AU
dc.subject.fieldofresearchEnvironmental Engineering Designen_US
dc.subject.fieldofresearchCircuits and Systemsen_US
dc.subject.fieldofresearchcode090701en_US
dc.subject.fieldofresearchcode090601en_US
dc.titlePlastic circuit reliability and design for recyclingen_US
dc.typeConference outputen_US
dc.type.descriptionE1 - Conference Publications (HERDC)en_US
dc.type.codeE - Conference Publicationsen_US
gro.facultyGriffith Sciences, Griffith School of Engineeringen_US
gro.rights.copyrightCopyright 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.en_AU
gro.date.issued2009
gro.hasfulltextFull Text


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    Contains papers delivered by Griffith authors at national and international conferences.

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