Upgraded EMC Modelling of Dual Die Structure

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Author(s)
Zhu, Boyuan
Lu, Junwei
Stegen, Sascha
Li, Erping
Griffith University Author(s)
Year published
2009
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Abstract
Due to the variety of internal structures applied in different processors, EMC modelling should also be upgraded correspondingly. This paper presents an upgraded EMC simulation model of dual die structure which is originated from the IEEE electromagnetic challenging problem 2000-4 for conventional CPU with heatsink. The simulation results are verified by measurement with a fabricated model. Furthermore, a consequent benchmark will be provided.
Conference Title
ELECTROMAGNETIC COMPATIBILITY SYMPOSIUM 2009, SYMPOSIUM PROCEEDINGS
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Subject
Electrical and Electronic Engineering not elsewhere classified
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