Upgraded EMC Modelling of Dual Die Structure
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Due to the variety of internal structures applied in different processors, EMC modelling should also be upgraded correspondingly. This paper presents an upgraded EMC simulation model of dual die structure which is originated from the IEEE electromagnetic challenging problem 2000-4 for conventional CPU with heatsink. The simulation results are verified by measurement with a fabricated model. Furthermore, a consequent benchmark will be provided.
Electromagnetic Compatibility Symposium Adelaide 2009
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Electrical and Electronic Engineering not elsewhere classified