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dc.contributor.convenorPaul Kayen_AU
dc.contributor.authorZhu, Boyuanen_US
dc.contributor.authorLu, Junweien_US
dc.contributor.authorStegen, Saschaen_US
dc.contributor.editorPaul Kayen_US
dc.date.accessioned2017-04-24T09:12:10Z
dc.date.available2017-04-24T09:12:10Z
dc.date.issued2009en_US
dc.date.modified2010-06-03T09:03:02Z
dc.identifier.refurihttp://www.emcsa.org.au/en_AU
dc.identifier.doi10.1109/EMCSA.2009.5349765en_AU
dc.identifier.urihttp://hdl.handle.net/10072/29989
dc.description.abstractDue to the variety of internal structures applied in different processors, EMC modelling should also be upgraded correspondingly. This paper presents an upgraded EMC simulation model of dual die structure which is originated from the IEEE electromagnetic challenging problem 2000-4 for conventional CPU with heatsink. The simulation results are verified by measurement with a fabricated model. Furthermore, a consequent benchmark will be provided.en_US
dc.description.peerreviewedYesen_US
dc.description.publicationstatusYesen_AU
dc.format.extent2279585 bytes
dc.format.mimetypeapplication/pdf
dc.languageEnglishen_US
dc.language.isoen_AU
dc.publisherIEEEen_US
dc.publisher.placeLos Alamitos, CAen_US
dc.relation.ispartofstudentpublicationNen_AU
dc.relation.ispartofconferencenameElectromagnetic Compatibility Symposium Adelaide 2009en_US
dc.relation.ispartofconferencetitleElectromagnetic Compatibility Symposium Adelaide 2009en_US
dc.relation.ispartofdatefrom2009-09-16en_US
dc.relation.ispartofdateto2009-09-18en_US
dc.relation.ispartoflocationAdelaideen_US
dc.rights.retentionYen_AU
dc.subject.fieldofresearchElectrical and Electronic Engineering not elsewhere classifieden_US
dc.subject.fieldofresearchcode090699en_US
dc.titleUpgraded EMC Modelling of Dual Die Structureen_US
dc.typeConference outputen_US
dc.type.descriptionE1 - Conference Publications (HERDC)en_US
dc.type.codeE - Conference Publicationsen_US
gro.facultyGriffith Sciences, Griffith School of Engineeringen_US
gro.rights.copyrightCopyright 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.en_AU
gro.date.issued2009
gro.hasfulltextFull Text


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    Contains papers delivered by Griffith authors at national and international conferences.

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