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dc.contributor.authorMarsi, N
dc.contributor.authorMajlis, BY
dc.contributor.authorMohd-Yasin, F
dc.contributor.authorHamzah, AA
dc.contributor.authorRus, AZ Mohd
dc.date.accessioned2017-05-29T12:32:06Z
dc.date.available2017-05-29T12:32:06Z
dc.date.issued2016
dc.identifier.issn1757-8981
dc.identifier.doi10.1088/1757-899X/160/1/012037
dc.identifier.urihttp://hdl.handle.net/10072/336427
dc.description.abstractPresented herein are the effects of thermal hysteresis analyses of the MEMS packaged capacitive pressure sensor (CPS). The MEMS CPS was employed on Si-on-3C-SiC wafer that was performed using the hot wall low-pressure chemical vapour deposition (LPCVD) reactors at the Queensland Micro and Nanotechnology Center (QMNC), Griffith University and fabricated using the bulk-micromachining process. The MEMS CPS was operated at an extreme temperature up to 500°C and high external pressure at 5.0 MPa. The thermal hysteresis phenomenon that causes the deflection, strain and stress on the 3C-SiC diaphragm spontaneously influence the MEMS CPS performances. The differences of temperature, hysteresis, and repeatability test were presented to demonstrate the functionality of the MEMS packaged CPS. As expected, the output hysteresis has a low hysteresis (less than 0.05%) which has the hardness greater than the traditional silicon. By utilizing this low hysteresis, it was revealed that the MEMS packaged CPS has high repeatability and stability of the sensor.
dc.description.peerreviewedYes
dc.languageEnglish
dc.language.isoeng
dc.publisherInstitute of Physics Publishing
dc.relation.ispartofpagefrom012037-1
dc.relation.ispartofpageto012037-6
dc.relation.ispartofissue1
dc.relation.ispartofjournalIOP Conference Series: Materials Science and Engineering
dc.relation.ispartofvolume160
dc.subject.fieldofresearchMicroelectronics
dc.subject.fieldofresearchMicroelectromechanical systems (MEMS)
dc.subject.fieldofresearchcode400908
dc.subject.fieldofresearchcode401705
dc.titleThermal Hysteresis of MEMS Packaged Capacitive Pressure Sensor (CPS) Based 3C-SiC
dc.typeJournal article
dc.type.descriptionC1 - Articles
dc.type.codeC - Journal Articles
dcterms.licensehttps://creativecommons.org/licenses/by/3.0/
dc.description.versionVersion of Record (VoR)
gro.rights.copyright© The Author(s) 2016. Published under licence in IOP Conference Series: Materials Science and Engineering by IOP Publishing Ltd. Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
gro.hasfulltextFull Text
gro.griffith.authorMohd-Yasin, Faisal


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