Arbitrary shape multilayer interconnects EMC modelling and optimization
Author(s)
Zhu, B
Lu, J
Zhu, M
Jiang, M
Griffith University Author(s)
Year published
2015
Metadata
Show full item recordAbstract
In very-large-scale-integration (VLSI), arbitrary structure of interconnections leads to unpredictable parasitic capacitance that generates EMC issues, i.e., parasitic noise, signal disorder, control failure, data asynchronous, etc. This paper investigates an EMC modelling and optimization method in calculating interconnect capacitance of VLSI interconnects based on the finite element method (FEM). Two- and three-dimensional interconnect models are simulated and the results of capacitance extraction are compared with experimental measurements, which proved the consistency and accuracy of FEM. Furthermore, optimizations of ...
View more >In very-large-scale-integration (VLSI), arbitrary structure of interconnections leads to unpredictable parasitic capacitance that generates EMC issues, i.e., parasitic noise, signal disorder, control failure, data asynchronous, etc. This paper investigates an EMC modelling and optimization method in calculating interconnect capacitance of VLSI interconnects based on the finite element method (FEM). Two- and three-dimensional interconnect models are simulated and the results of capacitance extraction are compared with experimental measurements, which proved the consistency and accuracy of FEM. Furthermore, optimizations of coupling capacitance are applied on multilayer interconnection structures by the non-dominated sorting genetic algorithm II (NSGA-II).
View less >
View more >In very-large-scale-integration (VLSI), arbitrary structure of interconnections leads to unpredictable parasitic capacitance that generates EMC issues, i.e., parasitic noise, signal disorder, control failure, data asynchronous, etc. This paper investigates an EMC modelling and optimization method in calculating interconnect capacitance of VLSI interconnects based on the finite element method (FEM). Two- and three-dimensional interconnect models are simulated and the results of capacitance extraction are compared with experimental measurements, which proved the consistency and accuracy of FEM. Furthermore, optimizations of coupling capacitance are applied on multilayer interconnection structures by the non-dominated sorting genetic algorithm II (NSGA-II).
View less >
Conference Title
EMC Compo 2015 - 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
Subject
Electrical and Electronic Engineering not elsewhere classified