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  • Prediction of High-Density and High-Mobility Two-Dimensional Electron Gas at AlxGa1-xN/4H-SiC Interface

    Author(s)
    Shen, Z
    Zhang, F
    Dimitrijev, S
    Han, J
    Tian, L
    Yan, G
    Wen, Z
    Zhao, W
    Wang, L
    Liu, X
    Sun, G
    Zeng, Y
    Griffith University Author(s)
    Dimitrijev, Sima
    Year published
    2017
    Metadata
    Show full item record
    Abstract
    This work presents theoretical demonstration of two-dimensional electron gas (2DEG) at the interface between Al0.2Ga0.8N and 4H-SiC, based on the self-consistent solution of Schrödinger–Poisson equations. High sheet carrier density of 1.1×1013 cm-2 was obtained in the Al0.2Ga0.8N/4H-SiC heterostructure, which is comparable to the electron concentration in Al0.2Ga0.8N/GaN heterostructure. The current–voltage characteristics of a high-electron-mobility transistor (HEMT), based on the Al0.2Ga0.8N/4H-SiC heterostructure, show a saturated drain current of 1.5 A/mm at the gate voltage of 2 V and the transconductance of 194 mS/mm ...
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    This work presents theoretical demonstration of two-dimensional electron gas (2DEG) at the interface between Al0.2Ga0.8N and 4H-SiC, based on the self-consistent solution of Schrödinger–Poisson equations. High sheet carrier density of 1.1×1013 cm-2 was obtained in the Al0.2Ga0.8N/4H-SiC heterostructure, which is comparable to the electron concentration in Al0.2Ga0.8N/GaN heterostructure. The current–voltage characteristics of a high-electron-mobility transistor (HEMT), based on the Al0.2Ga0.8N/4H-SiC heterostructure, show a saturated drain current of 1.5 A/mm at the gate voltage of 2 V and the transconductance of 194 mS/mm at -3.95 V. In spite of interface-roughness scattering and phonon scattering, the 2DEG at the AlxGa1-xN/4H-SiC interface exhibits high electron mobility values of 3365 cm2/ (V·s) at 77K and 1120 cm2/ (V·s) at 300K. These results indicate that AlxGa1-xN/4H-SiC heterostructure can significantly improve the mobility of SiC based power switching devices.
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    Journal Title
    Materials Science Forum
    Volume
    897
    DOI
    https://doi.org/10.4028/www.scientific.net/MSF.897.719
    Subject
    Physical chemistry
    Materials engineering
    Publication URI
    http://hdl.handle.net/10072/340765
    Collection
    • Journal articles

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