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dc.contributor.authorTeo, Adrian JT
dc.contributor.authorLi, Holden
dc.contributor.authorTan, Say Hwa
dc.contributor.authorYoon, Yong-Jin
dc.date.accessioned2017-07-03T05:47:01Z
dc.date.available2017-07-03T05:47:01Z
dc.date.issued2017
dc.identifier.issn0960-1317
dc.identifier.doi10.1088/1361-6439/aa687d
dc.identifier.urihttp://hdl.handle.net/10072/341231
dc.description.abstractOptical MEMS devices provide fast detection, electromagnetic resilience and high sensitivity. Using this technology, an optical gratings based accelerometer design concept was developed for seismic motion detection purposes that provides miniaturization, high manufacturability, low costs and high sensitivity. Detailed in-house fabrication procedures of a double-sided deep reactive ion etching (DRIE) on a silicon-on-insulator (SOI) wafer for a micro opto electro mechanical system (MOEMS) device are presented and discussed. Experimental results obtained show that the conceptual device successfully captured motion similar to a commercial accelerometer with an average sensitivity of 13.6 mV G−1, and a highest recorded sensitivity of 44.1 mV G−1. A noise level of 13.5 mV was detected due to experimental setup limitations. This is the first MOEMS accelerometer developed using double-sided DRIE on SOI wafer for the application of seismic motion detection, and is a breakthrough technology platform to open up options for lower cost MOEMS devices.
dc.description.peerreviewedYes
dc.languageEnglish
dc.language.isoeng
dc.publisherInstitute of Physics
dc.relation.ispartofpagefrom067001-1
dc.relation.ispartofpageto067001-8
dc.relation.ispartofissue6
dc.relation.ispartofjournalJournal of Micromechanics and Microengineering
dc.relation.ispartofvolume27
dc.subject.fieldofresearchTechnology not elsewhere classified
dc.subject.fieldofresearchElectrical and Electronic Engineering
dc.subject.fieldofresearchEngineering
dc.subject.fieldofresearchTechnology
dc.subject.fieldofresearchcode109999
dc.subject.fieldofresearchcode0906
dc.subject.fieldofresearchcode09
dc.subject.fieldofresearchcode10
dc.titleAn optical MEMS accelerometer fabricated using double-sided deep reactive ion etching on silicon-on-insulator wafer
dc.typeJournal article
dc.type.descriptionC1 - Articles
dc.type.codeC - Journal Articles
gro.hasfulltextNo Full Text
gro.griffith.authorTan, Say Hwa H.
gro.griffith.authorTeo, Adrian J.


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