Robust Free-Standing Nano-Thin SiC Membranes Enable Direct Photolithography for MEMS Sensing Applications
MetadataShow full item record
This work presents fabrication of micro structures on sub–100 nm SiC membranes with a large aspect ratio up to 1:3200. Unlike conventional processes, this approach starts with Si wet etching to form suspended SiC membranes, followed by micro-machined processes to pattern free-standing microstructures such as cantilevers and micro bridges. This technique eliminates the sticking or the under-etching effects on free-standing structures, enhancing mechanical performance which is favorable for MEMS applications. In addition, post-Si-etching photography also enables the formation of metal electrodes on free standing SiC membranes to develop electrically-measurable devices. To proof this concept, the authors demonstrate a SiC pressure sensor by applying lithography and plasma etching on released ultrathin SiC films. The sensors exhibit excellent linear response to the applied pressure, as well as good repeatability. The proposed method opens a pathway for the development of self-sensing free-standing SiC sensors.
Advanced Engineering Materials
© 2017 John Wiley & Sons Ltd. This is the peer reviewed version of the following article: Robust Free-Standing Nano-Thin SiC Membranes Enable Direct Photolithography for MEMS Sensing Applications, Advanced Engineering Materials, 20,1,2017, which has been published in final form at 10.1002/adem.201700858. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Self-Archiving (http://olabout.wiley.com/WileyCDA/Section/id-828039.html)
This publication has been entered into Griffith Research Online as an Advanced Online Version.
Materials Engineering not elsewhere classified