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  • The Electromagnetic Compatibility Problems of Integrated Circuits

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    Zhu_2011_02Thesis.pdf (15.88Mb)
    Author(s)
    Zhu, Boyuan
    Primary Supervisor
    Lu, Junwei
    Other Supervisors
    Thiel, David
    Year published
    2011
    Metadata
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    Abstract
    With the constant speed of growth in semiconductor technology, integrated circuit (IC) has taken a considerable position in an electronic system. The integrated circuit is working in a low supply voltage with high operation frequency. The internal complexity and chip density are also increased dramatically. Modern microelectronic technology in wafer fabrication easily allows component densities to exceed one million transistors per die. So far, integrated circuits are suering from various and complicated electromagnetic environments. Being the heart of an electronic system, stability and reliability of the integrated circuit ...
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    With the constant speed of growth in semiconductor technology, integrated circuit (IC) has taken a considerable position in an electronic system. The integrated circuit is working in a low supply voltage with high operation frequency. The internal complexity and chip density are also increased dramatically. Modern microelectronic technology in wafer fabrication easily allows component densities to exceed one million transistors per die. So far, integrated circuits are suering from various and complicated electromagnetic environments. Being the heart of an electronic system, stability and reliability of the integrated circuit are of the most important requirement along with the techniques development. The demands of high electromagnetic compatibility (EMC) performance for integrated circuits are therefore broadly spread among semiconductor manufacturers and product users. Traditionally, EMC for IC is only considered at the post-design stage. Once built, it is only then that equipment is tested to see whether or not it conforms to the relevant standards. This can prove very expensive in terms of time, cost, and the potential need for retrot modications. Simulating a piece of equipment is potentially much faster and cheaper than taking a prototype or existing piece of equipment to a test-house. More importantly, it allows the engineer to \look into" the equipment and see where currents and elds are largest; this is almost impossible with physical testing. Recently, computational electromagnetics (CEM) technique has moved from pure mathematical analysis into design in engineering practice. It can provide a much easier, faster and more economical solution of prediction in EMC characteristics than conventional methods. Thus, EMC computer modelling and simulation of IC is going to play an important role in scientic research and industrial applications.
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    Thesis Type
    Thesis (PhD Doctorate)
    Degree Program
    Doctor of Philosophy (PhD)
    School
    Griffith School of Engineering
    DOI
    https://doi.org/10.25904/1912/2620
    Copyright Statement
    The author owns the copyright in this thesis, unless stated otherwise.
    Item Access Status
    Public
    Subject
    Electromagnetic compatibility
    Microelectronic technology
    Integrated circuits
    Computational electromagnetics
    Publication URI
    http://hdl.handle.net/10072/365527
    Collection
    • Theses - Higher Degree by Research

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