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  • Unintentionally doped epitaxial 3C-SiC (111) nanothin film as material for highly sensitive thermal sensors at high temperatures

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    Author(s)
    Dinh, Toan
    Hoang-Phuong, Phan
    Tuan-Khoa, Nguyen
    Balakrishnan, Vivekananthan
    Cheng, Han-Hao
    Hold, Leonie
    Lacopi, Alan
    Nam-Trung, Nguyen
    Dzung, Viet Dao
    Griffith University Author(s)
    Dao, Dzung V.
    Nguyen, Nam-Trung
    Nguyen Tuan, Khoa
    Year published
    2018
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    Abstract
    There is a growing interest and demand to develop sensors that operate at high temperatures. In this work, we investigate the temperature sensing properties of unintentionally doped n-type single crystalline cubic silicon carbide (SiC) for high temperatures up to 800 K. A highly sensitive temperature sensor was demonstrated with a temperature coefficient of conductivity (TCC) ranging from 1.96×104 to 5.18×104 ppm/K. The application of this material was successfully demonstrated as a hot film flow sensor with its high signal-to-noise response to air flow at elevated temperatures. The high TCC of the single crystalline SiC ...
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    There is a growing interest and demand to develop sensors that operate at high temperatures. In this work, we investigate the temperature sensing properties of unintentionally doped n-type single crystalline cubic silicon carbide (SiC) for high temperatures up to 800 K. A highly sensitive temperature sensor was demonstrated with a temperature coefficient of conductivity (TCC) ranging from 1.96×104 to 5.18×104 ppm/K. The application of this material was successfully demonstrated as a hot film flow sensor with its high signal-to-noise response to air flow at elevated temperatures. The high TCC of the single crystalline SiC film at and above 800 K strongly revealed its potential for highly sensitive thermal sensors working at high temperatures.
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    Journal Title
    IEEE Electron Device Letters
    Volume
    39
    Issue
    4
    DOI
    https://doi.org/10.1109/LED.2018.2808329
    Copyright Statement
    © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
    Subject
    Electronics, sensors and digital hardware
    Microelectromechanical systems (MEMS)
    Publication URI
    http://hdl.handle.net/10072/372599
    Collection
    • Journal articles

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