dc.contributor.author | Zhu, B | |
dc.contributor.author | Lu, J | |
dc.contributor.author | Li, E | |
dc.contributor.editor | Jing Liang HE | |
dc.date.accessioned | 2017-05-03T12:14:18Z | |
dc.date.available | 2017-05-03T12:14:18Z | |
dc.date.issued | 2010 | |
dc.date.modified | 2011-03-16T07:56:12Z | |
dc.identifier.isbn | 9781424456215 | |
dc.identifier.refuri | http://www.emc-zurich.org/ | |
dc.identifier.doi | 10.1109/APEMC.2010.5475514 | |
dc.identifier.uri | http://hdl.handle.net/10072/37283 | |
dc.description.abstract | This paper presents an EMC modelling approach for the latest dual die CPU with a heatsink from an antenna point of view. The model acts as a very efficient antenna while its structure is constructed almost according to a real dual die CPU structure. Different sizes of heatsink cooperate in the investigation of electromagnetic characterization. Simulation and measurement are accomplished in far-filed range. The results show that the dual die model without heatsink is resonating at two frequencies which are 2.04GHz and 4.9GHz. When a heatsink is mounted however the resonant frequencies are changed to 1.80GHz and 5.20GHz respectively. | |
dc.description.peerreviewed | Yes | |
dc.description.publicationstatus | Yes | |
dc.format.extent | 998492 bytes | |
dc.format.mimetype | application/pdf | |
dc.language | English | |
dc.language.iso | eng | |
dc.publisher | IEEE | |
dc.publisher.place | Beijing | |
dc.relation.ispartofstudentpublication | N | |
dc.relation.ispartofconferencename | IEEE APEMC2010 | |
dc.relation.ispartofconferencetitle | 2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010 | |
dc.relation.ispartofdatefrom | 2010-04-12 | |
dc.relation.ispartofdateto | 2010-04-16 | |
dc.relation.ispartoflocation | Beijing | |
dc.relation.ispartofpagefrom | 932 | |
dc.relation.ispartofpageto | 935 | |
dc.rights.retention | Y | |
dc.subject.fieldofresearch | Electrical and Electronic Engineering not elsewhere classified | |
dc.subject.fieldofresearchcode | 090699 | |
dc.title | EMC Modelling of Dual Die CPU with a Heatsink | |
dc.type | Conference output | |
dc.type.description | E1 - Conferences | |
dc.type.code | E - Conference Publications | |
gro.faculty | Griffith Sciences, Griffith School of Engineering | |
gro.rights.copyright | © 2010 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. | |
gro.date.issued | 2010 | |
gro.hasfulltext | Full Text | |
gro.griffith.author | Lu, Junwei | |