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dc.contributor.authorToan, Dinh
dc.contributor.authorHoang-Phuong, Phan
dc.contributor.authorKashaninejad, Navid
dc.contributor.authorTuan-Khoa, Nguyen
dc.contributor.authorDzung, Viet Dao
dc.contributor.authorNam-Trung, Nguyen
dc.date.accessioned2019-05-29T12:40:59Z
dc.date.available2019-05-29T12:40:59Z
dc.date.issued2018
dc.identifier.issn2196-7350
dc.identifier.doi10.1002/admi.201800764
dc.identifier.urihttp://hdl.handle.net/10072/381752
dc.description.abstractThere has been increasing interest in electronic systems with integrated microfluidic active cooling modules. However, the failure of 3C‐SiC/Si interface with increasing temperature has prevented the development of 3C‐SiC power electronic devices. Here, all integrated transparent heating, sensing, and cooling systems are developed on a single silicon carbide (SiC) chip for efficient thermal management. SiC nanofilms are grown on a silicon wafer, are transferred to a glass substrate, and then a micro electromechanical system process is employed to fabricate a SiC‐on‐glass system with integrated heaters and temperature sensors. A cooling system is fabricated with microchannel using 3D printing, molding, and plasma assisted bonding. The thermal management of the SiC‐based system shows an excellent capability of heating and detecting temperature as well as effective cooling with an efficiency of from 0.24 to 0.28 and a maximum cooling rate of 0.1 K(µL min−1)−1. The fabrication strategy can be utilized for large production of SiC power nanoelectronics with high efficiency of integrated thermal management systems.
dc.description.peerreviewedYes
dc.languageEnglish
dc.language.isoeng
dc.publisherWiley Online
dc.publisher.placeGermany
dc.relation.ispartofchapter1800764
dc.relation.ispartofpagefrom1
dc.relation.ispartofpageto9
dc.relation.ispartofissue20
dc.relation.ispartofjournalAdvanced Materials Interfaces
dc.relation.ispartofvolume5
dc.subject.fieldofresearchPhysical chemistry
dc.subject.fieldofresearchMaterials engineering
dc.subject.fieldofresearchMicrofluidics and nanofluidics
dc.subject.fieldofresearchMicroelectromechanical systems (MEMS)
dc.subject.fieldofresearchMacromolecular and materials chemistry
dc.subject.fieldofresearchCondensed matter physics
dc.subject.fieldofresearchcode3406
dc.subject.fieldofresearchcode4016
dc.subject.fieldofresearchcode401210
dc.subject.fieldofresearchcode401705
dc.subject.fieldofresearchcode3403
dc.subject.fieldofresearchcode5104
dc.titleAn On-Chip SiC MEMS Device with Integrated Heating, Sensing, and Microfluidic Cooling Systems
dc.typeJournal article
dc.type.descriptionC1 - Articles
dc.type.codeC - Journal Articles
gro.facultyGriffith Sciences, School of Engineering and Built Environment
gro.hasfulltextNo Full Text
gro.griffith.authorDao, Dzung V.
gro.griffith.authorNguyen, Nam-Trung
gro.griffith.authorKashaninejad, Navid
gro.griffith.authorNguyen, Khoa T.


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