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  • Dependence of offset voltage in AlGaN/GaN van der Pauw devices under mechanical strain

    Author(s)
    Hong-Quan, Nguyen
    Moghadam, Hamid Amini
    Toan, Dinh
    Hoang-Phuong, Phan
    Tuan-Khoa, Nguyen
    Han, Jisheng
    Dimitrijev, Sima
    Nam-Trung, Nguyen
    Dzung, Viet Dao
    Griffith University Author(s)
    Nguyen, Nam-Trung
    Dimitrijev, Sima
    Dao, Dzung V.
    Nguyen Tuan, Khoa
    Nguyen, Hong Q.
    Year published
    2019
    Metadata
    Show full item record
    Abstract
    This work reports the strain dependence of the offset voltage in an AlGaN/GaN van der Pauw device under mechanical strain. The AlGaN/GaN heterostructure was grown on a sapphire (0 0 0 1) wafer by using a metal organic chemical vapor deposition (MOCVD) process. Taking advantage of the four-terminal configuration, the fabricated van der Pauw device exhibited an excellent repeatability and linearity with a significant change of the offset voltage under application of tensile and compressive strains. In particular, the sensitivity of the device to the applied strain was found to be as large as 3 (µV/V)/ppm, indicating the ...
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    This work reports the strain dependence of the offset voltage in an AlGaN/GaN van der Pauw device under mechanical strain. The AlGaN/GaN heterostructure was grown on a sapphire (0 0 0 1) wafer by using a metal organic chemical vapor deposition (MOCVD) process. Taking advantage of the four-terminal configuration, the fabricated van der Pauw device exhibited an excellent repeatability and linearity with a significant change of the offset voltage under application of tensile and compressive strains. In particular, the sensitivity of the device to the applied strain was found to be as large as 3 (µV/V)/ppm, indicating the feasibility of using this effect for mechanical sensing applications. The sensing mechanism of the device is explained via the alteration of the sheet carrier concentration at the AlGaN/GaN interface and the asymmetric current flux in the 2DEG van der Pauw device.
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    Journal Title
    MATERIALS LETTERS
    Volume
    244
    DOI
    https://doi.org/10.1016/j.matlet.2019.02.050
    Subject
    Physical sciences
    Chemical sciences
    Engineering
    Materials engineering
    Publication URI
    http://hdl.handle.net/10072/383093
    Collection
    • Journal articles

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