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dc.contributor.authorZhang, Yubai
dc.contributor.authorShi, Ge
dc.contributor.authorQin, Jiadong
dc.contributor.authorLowe, Sean E
dc.contributor.authorZhang, Shanqing
dc.contributor.authorZhao, Huijun
dc.contributor.authorZhong, Yu Lin
dc.date.accessioned2020-03-22T21:31:11Z
dc.date.available2020-03-22T21:31:11Z
dc.date.issued2019
dc.identifier.issn2637-6113
dc.identifier.doi10.1021/acsaelm.9b00428
dc.identifier.urihttp://hdl.handle.net/10072/392363
dc.description.abstractThree-dimensional (3D) printing technology has been recognized as an emerging advanced fabrication technology in both industry and academia. Direct ink writing (DIW), a type of 3D printing technology, can build 3D structures through the deposition of custom-made inks, printing devices with complex architectures, excellent mechanical properties, and enhanced functionalities. DIW can greatly facilitate the fabrication of miniaturized or flexible electronic components. These components are potentially useful for their applications in advanced wearable devices. This article highlights recent advancements in 3D direct ink written electronic components with an emphasis on their potential applications for wearable devices. The relationship among ink formulations, DIW techniques, and printed devices is highlighted. In particular, the DIW-assisted fabrication of key components in wearable electronics, including power generation (nanogenerators), energy storage (e.g., lithium ion batteries), and energy consuming products (e.g., strain sensors) are reviewed in terms of performance metrics and fabrication strategies. Optimized ink preparations, evolving DIW techniques, and device designs can work synergistically to enhance the development of printed advanced wearable devices.
dc.description.peerreviewedYes
dc.languageEnglish
dc.language.isoeng
dc.publisherAmerican Chemical Society
dc.relation.ispartofpagefrom1718
dc.relation.ispartofpageto1734
dc.relation.ispartofissue9
dc.relation.ispartofjournalACS Applied Electronic Materials
dc.relation.ispartofvolume1
dc.subject.fieldofresearchEnvironmental Sciences
dc.subject.fieldofresearchcode05
dc.subject.keywordsScience & Technology
dc.subject.keywordsTechnology
dc.subject.keywordsEngineering, Electrical & Electronic
dc.subject.keywordsMaterials Science, Multidisciplinary
dc.subject.keywordsEngineering
dc.titleRecent Progress of Direct Ink Writing of Electronic Components for Advanced Wearable Devices
dc.typeJournal article
dc.type.descriptionC1 - Articles
dcterms.bibliographicCitationZhang, Y; Shi, G; Qin, J; Lowe, SE; Zhang, S; Zhao, H; Zhong, YL, Recent Progress of Direct Ink Writing of Electronic Components for Advanced Wearable Devices, ACS Applied Electronic Materials, 2019, 1 (9), pp. 1718-1734
dc.date.updated2020-03-17T02:49:43Z
dc.description.versionAccepted Manuscript (AM)
gro.rights.copyrightThis document is the Accepted Manuscript version of a Published Work that appeared in final form in ACS Medicinal Chemistry Letters, © 2019 American Chemical Society after peer review and technical editing by the publisher. To access the final edited and published work see https://doi.org/10.1021/acsaelm.9b00428
gro.hasfulltextFull Text
gro.griffith.authorZhong, Yulin
gro.griffith.authorZhao, Huijun
gro.griffith.authorZhang, Shanqing
gro.griffith.authorZhang, Yubai
gro.griffith.authorQin, Jiadong
gro.griffith.authorShi, Ge
gro.griffith.authorLowe, Sean


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