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  • Palladium on paper as a low-cost and flexible material for fast hydrogen sensing

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    Wang364547-Accepted.pdf (1.481Mb)
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    Accepted Manuscript (AM)
    Author(s)
    Wang, Boyi
    Nara, Yasumasa
    Hashishin, Takeshi
    Dao, Dzung Viet
    Zhu, Yong
    Griffith University Author(s)
    Zhu, Yong
    Dao, Dzung V.
    Year published
    2020
    Metadata
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    Abstract
    To improve the hydrogen detection performance, a flexible palladium-based hydrogen sensor was designed and fabricated on normal photocopy paper. The paper substrate offers advantages such as light weight, low cost, flexibility and unique surface texture. A conventional vacuum evaporation technique was utilized for 60 nm palladium deposition on the paper and glass substrates. The unique surface texture of the paper effectively increased the surface area to volume ratio for the sensing element, which achieved a higher gas response with faster speed than the glass-based sensor. In addition, we investigated the temperature impacts ...
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    To improve the hydrogen detection performance, a flexible palladium-based hydrogen sensor was designed and fabricated on normal photocopy paper. The paper substrate offers advantages such as light weight, low cost, flexibility and unique surface texture. A conventional vacuum evaporation technique was utilized for 60 nm palladium deposition on the paper and glass substrates. The unique surface texture of the paper effectively increased the surface area to volume ratio for the sensing element, which achieved a higher gas response with faster speed than the glass-based sensor. In addition, we investigated the temperature impacts on sensing performance of the paper-based hydrogen sensor at room temperature and 50 °C. Furthermore, the flexibility test results of the paper-based hydrogen sensor showed that the sensing performances were impervious to mechanical bending of 5.7°.
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    Journal Title
    Journal of Materials Science: Materials in Electronics
    Volume
    31
    Issue
    7
    DOI
    https://doi.org/10.1007/s10854-020-03090-7
    Copyright Statement
    © 2020 Springer New York. This is an electronic version of an article published in Journal of Materials Science: Materials in Electronics 2020, 31 (7), pp. 5298-5304. Journal of Materials Science: Materials in Electronics is available online at: http://link.springer.com/ with the open URL of your article.
    Subject
    Electrical engineering
    Electronics, sensors and digital hardware
    Materials engineering
    Science & Technology
    Physical Sciences
    Materials Science, Multidisciplinary
    Publication URI
    http://hdl.handle.net/10072/396774
    Collection
    • Journal articles

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