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  • A Versatile Sacrificial Layer for Transfer Printing of Wide Bandgap Materials for Implantable and Stretchable Bioelectronics

    Author(s)
    Pham, Tuan-Anh
    Nguyen, Tuan-Khoa
    Vadivelu, Raja Kumar
    Dinh, Toan
    Qamar, Afzaal
    Yadav, Sharda
    Yamauchi, Yusuke
    Rogers, John A
    Nguyen, Nam-Trung
    Phan, Hoang-Phuong
    Griffith University Author(s)
    Nguyen, Nam-Trung
    Yadav, Sharda
    Nguyen Tuan, Khoa
    Year published
    2020
    Metadata
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    Abstract
    Improving and optimizing the processes for transfer printing have the potential to further enhance capabilities in heterogeneous integration of various sensing materials on unconventional substrates for implantable and stretchable electronic devices in biosensing, diagnostics, and therapeutic applications. An advanced transfer printing method based on sacrificial layer engineering for silicon carbide materials in stretchable electronic devices is presented here. In contrast to the typical processes where defined anchor structures are required for the transfer step, the use of a sacrificial layer offers enhances versatility ...
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    Improving and optimizing the processes for transfer printing have the potential to further enhance capabilities in heterogeneous integration of various sensing materials on unconventional substrates for implantable and stretchable electronic devices in biosensing, diagnostics, and therapeutic applications. An advanced transfer printing method based on sacrificial layer engineering for silicon carbide materials in stretchable electronic devices is presented here. In contrast to the typical processes where defined anchor structures are required for the transfer step, the use of a sacrificial layer offers enhances versatility in releasing complex microstructures from rigid donor substrates to flexible receiver platforms. The sacrificial layer also minimizes twisting and wrinkling issues that may occur in free‐standing microstructures, thereby facilitating printing onto flat polymer surfaces (e.g., polydimethylsiloxane). The experimental results demonstrate that transferred SiC microstructures exhibit good stretchability, stable electrical properties, excellent biocompatibility, as well as promising sensing‐functions associated with a high level of structural perfection, without any cracks or tears. This transfer printing method can be applied to other classes of wide bandgap semiconductors, particularly group III‐nitrides and diamond films epitaxially grown on Si substrates, thereby serving as the foundation for the development and possible commercialization of implantable and stretchable bioelectronic devices that exploit wide bandgap materials.
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    Journal Title
    Advanced Functional Materials
    DOI
    https://doi.org/10.1002/adfm.202004655
    Note
    This publication has been entered in Griffith Research Online as an advanced online version.
    Subject
    Physical sciences
    Chemical sciences
    Engineering
    Science & Technology
    Physical Sciences
    Technology
    Chemistry, Multidisciplinary
    Chemistry, Physical
    Publication URI
    http://hdl.handle.net/10072/397723
    Collection
    • Journal articles

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