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  • Ultrasensitive strain sensor enhanced by bonded light emitting diodes

    Author(s)
    Nguyen, T
    Dinh, T
    Dau, VT
    Md Foisal, AR
    Nguyen, H
    Vu, H
    Pham, TA
    Tran, CD
    Nguyen, TK
    Phan, HP
    Nguyen, NT
    Dao, DV
    Griffith University Author(s)
    Nguyen Tuan, Khoa
    Dao, Dzung V.
    Dau, Van
    Nguyen, Nam-Trung
    Year published
    2021
    Metadata
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    Abstract
    Herein we report a strain sensor with SiC/Si heterostructure exhibiting performance enhanced toward ultra-sensitivity using a bonded pico-light-emitting-diode. First, a cantilever with SiC/Si heterostructure is fabricated, followed by bonding a pico-LED on the top of the cantilever. The lateral photovoltage and photocurrent, then, are investigated under different LED supply voltages. The lateral photovoltage and photocurrent are as high as 7.9 mV and 19.06 A, respectively, as the bonded LED is powered by a supply voltage of 6V. Finally, the performance of the strain sensor was investigated. When the bonded LED is OFF, the ...
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    Herein we report a strain sensor with SiC/Si heterostructure exhibiting performance enhanced toward ultra-sensitivity using a bonded pico-light-emitting-diode. First, a cantilever with SiC/Si heterostructure is fabricated, followed by bonding a pico-LED on the top of the cantilever. The lateral photovoltage and photocurrent, then, are investigated under different LED supply voltages. The lateral photovoltage and photocurrent are as high as 7.9 mV and 19.06 A, respectively, as the bonded LED is powered by a supply voltage of 6V. Finally, the performance of the strain sensor was investigated. When the bonded LED is OFF, the gauge factor (GF) of the strain sensor is 20.5. This GF significantly increases to 18, 000 when the bonded LED is ON, which is thousand-time modulation. In other word, the strain sensor with bonded LED has ultra-high sensitivity.
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    Conference Title
    Proceedings of 2021 IEEE Sensors
    Volume
    2021-October
    DOI
    https://doi.org/10.1109/SENSORS47087.2021.9639603
    Subject
    Electronics, sensors and digital hardware
    Publication URI
    http://hdl.handle.net/10072/412436
    Collection
    • Conference outputs

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