Electromagnetic Compatibility Benchmark-Modeling Approach for a Dual-Die CPU
Author(s)
Zhu, Boyuan
Lu, Junwei
Li, Erping
Griffith University Author(s)
Year published
2011
Metadata
Show full item recordAbstract
Abstract-The traditional challenging problem 2000-4 of electromagnetics (as indicated by the IEEE) proposed a benchmark model of a conventional CPU with a heatsink. However, after CPU entered the multiple-die century, the original model is no longer effective for the new generation multiple-die package. A novel model is proposed in this paper for electromagnet radiation modeling of the CPU with dual dies as a new electromagnetic compatibility benchmark-modeling approach. Themodeling method is validated by the measurement, and the simulation and measurement results showed a good agreement, and demonstrated it is an ...
View more >Abstract-The traditional challenging problem 2000-4 of electromagnetics (as indicated by the IEEE) proposed a benchmark model of a conventional CPU with a heatsink. However, after CPU entered the multiple-die century, the original model is no longer effective for the new generation multiple-die package. A novel model is proposed in this paper for electromagnet radiation modeling of the CPU with dual dies as a new electromagnetic compatibility benchmark-modeling approach. Themodeling method is validated by the measurement, and the simulation and measurement results showed a good agreement, and demonstrated it is an effective modeling technique.
View less >
View more >Abstract-The traditional challenging problem 2000-4 of electromagnetics (as indicated by the IEEE) proposed a benchmark model of a conventional CPU with a heatsink. However, after CPU entered the multiple-die century, the original model is no longer effective for the new generation multiple-die package. A novel model is proposed in this paper for electromagnet radiation modeling of the CPU with dual dies as a new electromagnetic compatibility benchmark-modeling approach. Themodeling method is validated by the measurement, and the simulation and measurement results showed a good agreement, and demonstrated it is an effective modeling technique.
View less >
Journal Title
IEEE Transactions on Electromagnetic Compatibility
Volume
53
Issue
1
Subject
Classical physics
Microelectronics