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  • Electromagnetic Compatibility Benchmark-Modeling Approach for a Dual-Die CPU

    Author(s)
    Zhu, Boyuan
    Lu, Junwei
    Li, Erping
    Griffith University Author(s)
    Lu, Junwei
    Year published
    2011
    Metadata
    Show full item record
    Abstract
    Abstract-The traditional challenging problem 2000-4 of electromagnetics (as indicated by the IEEE) proposed a benchmark model of a conventional CPU with a heatsink. However, after CPU entered the multiple-die century, the original model is no longer effective for the new generation multiple-die package. A novel model is proposed in this paper for electromagnet radiation modeling of the CPU with dual dies as a new electromagnetic compatibility benchmark-modeling approach. Themodeling method is validated by the measurement, and the simulation and measurement results showed a good agreement, and demonstrated it is an ...
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    Abstract-The traditional challenging problem 2000-4 of electromagnetics (as indicated by the IEEE) proposed a benchmark model of a conventional CPU with a heatsink. However, after CPU entered the multiple-die century, the original model is no longer effective for the new generation multiple-die package. A novel model is proposed in this paper for electromagnet radiation modeling of the CPU with dual dies as a new electromagnetic compatibility benchmark-modeling approach. Themodeling method is validated by the measurement, and the simulation and measurement results showed a good agreement, and demonstrated it is an effective modeling technique.
    View less >
    Journal Title
    IEEE Transactions on Electromagnetic Compatibility
    Volume
    53
    Issue
    1
    DOI
    https://doi.org/10.1109/TEMC.2010.2053208
    Subject
    Classical physics
    Microelectronics
    Publication URI
    http://hdl.handle.net/10072/43242
    Collection
    • Journal articles

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