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dc.contributor.authorZhu, Boyuanen_US
dc.contributor.authorLu, Junweien_US
dc.contributor.authorLi, Erpingen_US
dc.date.accessioned2017-05-03T12:14:22Z
dc.date.available2017-05-03T12:14:22Z
dc.date.issued2011en_US
dc.date.modified2012-03-02T04:45:37Z
dc.identifier.issn00189375en_US
dc.identifier.doi10.1109/TEMC.2010.2053208en_US
dc.identifier.urihttp://hdl.handle.net/10072/43242
dc.description.abstractAbstract-The traditional challenging problem 2000-4 of electromagnetics (as indicated by the IEEE) proposed a benchmark model of a conventional CPU with a heatsink. However, after CPU entered the multiple-die century, the original model is no longer effective for the new generation multiple-die package. A novel model is proposed in this paper for electromagnet radiation modeling of the CPU with dual dies as a new electromagnetic compatibility benchmark-modeling approach. Themodeling method is validated by the measurement, and the simulation and measurement results showed a good agreement, and demonstrated it is an effective modeling technique.en_US
dc.description.peerreviewedYesen_US
dc.description.publicationstatusYesen_US
dc.languageEnglishen_US
dc.publisherIEEEen_US
dc.publisher.placeUnited Statesen_US
dc.relation.ispartofstudentpublicationNen_US
dc.relation.ispartofpagefrom91en_US
dc.relation.ispartofpageto98en_US
dc.relation.ispartofissue1en_US
dc.relation.ispartofjournalIEEE Transactions on Electromagnetic Compatibilityen_US
dc.relation.ispartofvolume53en_US
dc.rights.retentionYen_US
dc.subject.fieldofresearchMicroelectronics and Integrated Circuitsen_US
dc.subject.fieldofresearchcode090604en_US
dc.titleElectromagnetic Compatibility Benchmark-Modeling Approach for a Dual-Die CPUen_US
dc.typeJournal articleen_US
dc.type.descriptionC1 - Peer Reviewed (HERDC)en_US
dc.type.codeC - Journal Articlesen_US
gro.facultyGriffith Sciences, Griffith School of Engineeringen_US
gro.date.issued2011
gro.hasfulltextNo Full Text


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