• myGriffith
    • Staff portal
    • Contact Us⌄
      • Future student enquiries 1800 677 728
      • Current student enquiries 1800 154 055
      • International enquiries +61 7 3735 6425
      • General enquiries 07 3735 7111
      • Online enquiries
      • Staff phonebook
    View Item 
    •   Home
    • Griffith Research Online
    • Conference outputs
    • View Item
    • Home
    • Griffith Research Online
    • Conference outputs
    • View Item
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Browse

  • All of Griffith Research Online
    • Communities & Collections
    • Authors
    • By Issue Date
    • Titles
  • This Collection
    • Authors
    • By Issue Date
    • Titles
  • Statistics

  • Most Popular Items
  • Statistics by Country
  • Most Popular Authors
  • Support

  • Contact us
  • FAQs
  • Admin login

  • Login
  • EMC Modelling and Optimization for Reducing Capacitances of Interconnections with Arbitrary Shape in Multilayer VLSI Circuits

    Thumbnail
    View/Open
    73396_1.pdf (303.3Kb)
    Author(s)
    Zhu, Boyuan
    Lu, Junwei
    Zhu, M.
    Griffith University Author(s)
    Lu, Junwei
    Zhu, Boyuan
    Year published
    2011
    Metadata
    Show full item record
    Abstract
    This paper presents an EMC modelling method for the purpose of calculating the interconnect capacitance between VLSI interconnects based on the finite element method (FEM). Two- and three-dimensional interconnect models are simulated and the results of capacitance extraction are compared with experimental measurements, which proved the consistency and accuracy of FEM. Furthermore, optimizations of coupling capacitance are applied on two- and three-dimensional multilayer interconnection structures by the non-dominated sorting genetic algorithm II (NSGA-II), which shows a capacity for optimization. They are applicable to ...
    View more >
    This paper presents an EMC modelling method for the purpose of calculating the interconnect capacitance between VLSI interconnects based on the finite element method (FEM). Two- and three-dimensional interconnect models are simulated and the results of capacitance extraction are compared with experimental measurements, which proved the consistency and accuracy of FEM. Furthermore, optimizations of coupling capacitance are applied on two- and three-dimensional multilayer interconnection structures by the non-dominated sorting genetic algorithm II (NSGA-II), which shows a capacity for optimization. They are applicable to arbitrary structures in very-large-scale-integration (VLSI).
    View less >
    Conference Title
    Proceedings of COMPUMAG2011
    Publisher URI
    http://www.compumag2011.com/
    Copyright Statement
    © 2011 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
    Subject
    Microelectronics and Integrated Circuits
    Publication URI
    http://hdl.handle.net/10072/43543
    Collection
    • Conference outputs

    Footer

    Disclaimer

    • Privacy policy
    • Copyright matters
    • CRICOS Provider - 00233E
    • TEQSA: PRV12076

    Tagline

    • Gold Coast
    • Logan
    • Brisbane - Queensland, Australia
    First Peoples of Australia
    • Aboriginal
    • Torres Strait Islander