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  • Development of Fabrication Process for Large-Displacement Polymer MEMS with Stacked Movable Structures Based on Hot Embossing and Polishing

    Author(s)
    Amaya, S
    Dao, VD
    Sugiyama, S
    Griffith University Author(s)
    Dao, Dzung V.
    Year published
    2011
    Metadata
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    Abstract
    This paper reports on our study of a fabrication process for polymer MEMS devices utilizing hot-embossing and polishing steps. In this paper, a PMMA thermal microactuator was developed and characterized to demonstrate the process's capability and robustness. In the hot-embossing step, a two-step silicon mold fabricated using bulk micromachining technology was used to create PMMA microstructures. Then, the hot-embossed structures were bonded to the PMMA substrate using a surface activation bonding method, and the back layer of the hot-embossed PMMA structure that remained after hot embossing was removed by a polishing step ...
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    This paper reports on our study of a fabrication process for polymer MEMS devices utilizing hot-embossing and polishing steps. In this paper, a PMMA thermal microactuator was developed and characterized to demonstrate the process's capability and robustness. In the hot-embossing step, a two-step silicon mold fabricated using bulk micromachining technology was used to create PMMA microstructures. Then, the hot-embossed structures were bonded to the PMMA substrate using a surface activation bonding method, and the back layer of the hot-embossed PMMA structure that remained after hot embossing was removed by a polishing step to release the movable microstructures. A V-shaped PMMA thermal microactuator with a thickness of about 50 孠was fabricated and tested successfully. The displacement was about 10 times larger than that of a Si counterpart at the same temperature difference.
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    Journal Title
    Journal of Japan Institute of Electronics Packaging
    Volume
    14
    Issue
    6
    Publisher URI
    http://www.e-jisso.jp/publish/journal/pdf/146/14060507.pdf
    Subject
    Microtechnology
    Publication URI
    http://hdl.handle.net/10072/44866
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    • Journal articles

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