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  • Specific contact resistance of ohmic contacts to n-type SiC membranes

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    Author(s)
    Mohd Nasir, NF
    Holland, AS
    Reeves, GK
    Leech, PW
    Collins, A
    Tanner, P
    Griffith University Author(s)
    Tanner, Philip G.
    Year published
    2012
    Metadata
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    Abstract
    Membranes of epitaxial SiC have been used as a means of eliminating the leakage current into the Si substrate during circular transmission line model (CTLM) measurements. In the n+-3C-SiC/Si wafers, the Si substrate was etched in a patterned window with dimensions up to 10 mm נ15 mm2. An array of CTLM metal contacts was then deposited onto the upper surface of the n+-SiC membrane. The CTLM contacts on the membrane have shown an ohmic current/voltage response while electrodes located on the adjacent substrate were non-ohmic. Values of ?c were measured directly on the membranes. These results have shown a significant increase ...
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    Membranes of epitaxial SiC have been used as a means of eliminating the leakage current into the Si substrate during circular transmission line model (CTLM) measurements. In the n+-3C-SiC/Si wafers, the Si substrate was etched in a patterned window with dimensions up to 10 mm נ15 mm2. An array of CTLM metal contacts was then deposited onto the upper surface of the n+-SiC membrane. The CTLM contacts on the membrane have shown an ohmic current/voltage response while electrodes located on the adjacent substrate were non-ohmic. Values of ?c were measured directly on the membranes. These results have shown a significant increase in the current flow below the metal contacts due to the presence of the Si substrate.
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    Conference Title
    Materials Research Society Symposium Proceedings
    Volume
    1335
    DOI
    https://doi.org/10.1557/opl.2011.1202
    Copyright Statement
    © 2011 Materials Research Society, published by Cambridge University Press. The attached file is reproduced here in accordance with the copyright policy of the publisher. Please refer to the conference's website for access to the definitive, published version.
    Subject
    Electrical and Electronic Engineering not elsewhere classified
    Publication URI
    http://hdl.handle.net/10072/46186
    Collection
    • Conference outputs

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