Environment Friendly MEMS Process
Author(s)
Dao, Dzung Viet
Nakamura, Koichi
Amikura, M.
Ota, R.
Morikawa, Y.
Ohara, J.
Asami, K.
Sugiyama, Susumu
Griffith University Author(s)
Year published
2011
Metadata
Show full item recordAbstract
This work presents our recent research and development of environment-friendly MEMS fabrication technology based on an eco-friendly silicon deep reactive ion etching (D-RIE), and polymer-MEMS utilizing hot embossing process. In order to show the capability of this 'Green' fabrication technology, several typical MEMS devices have been fabricated successfully.This work presents our recent research and development of environment-friendly MEMS fabrication technology based on an eco-friendly silicon deep reactive ion etching (D-RIE), and polymer-MEMS utilizing hot embossing process. In order to show the capability of this 'Green' fabrication technology, several typical MEMS devices have been fabricated successfully.
View less >
View less >
Conference Title
Technical Digest of International Workshop on Green Devices and Micro Systems (GDMS 2011)
Publisher URI
Subject
Microtechnology