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Environment Friendly MEMS Process

dc.contributor.convenorDr. Ruytaro Maeda
dc.contributor.authorDao, Dzung Viet
dc.contributor.authorNakamura, Koichi
dc.contributor.authorAmikura, M.
dc.contributor.authorOta, R.
dc.contributor.authorMorikawa, Y.
dc.contributor.authorOhara, J.
dc.contributor.authorAsami, K.
dc.contributor.authorSugiyama, Susumu
dc.contributor.editorRuytaro Maeda
dc.date.accessioned2017-05-03T16:09:05Z
dc.date.available2017-05-03T16:09:05Z
dc.date.issued2011
dc.date.modified2012-08-27T12:36:29Z
dc.identifier.urihttp://hdl.handle.net/10072/46597
dc.description.abstractThis work presents our recent research and development of environment-friendly MEMS fabrication technology based on an eco-friendly silicon deep reactive ion etching (D-RIE), and polymer-MEMS utilizing hot embossing process. In order to show the capability of this 'Green' fabrication technology, several typical MEMS devices have been fabricated successfully.
dc.description.publicationstatusYes
dc.languageEnglish
dc.publisherG-Device Center@BEANS Laboratory
dc.publisher.placeTsukuba, Japan
dc.publisher.urihttp://unit.aist.go.jp/umemsme/files/GDMS2011.htm
dc.relation.ispartofstudentpublicationN
dc.relation.ispartofconferencenameInternational Workshop on Green Devices and Micro Systems (GDMS 2011)
dc.relation.ispartofconferencetitleTechnical Digest of International Workshop on Green Devices and Micro Systems (GDMS 2011)
dc.relation.ispartofdatefrom2011-02-09
dc.relation.ispartofdateto2011-02-09
dc.relation.ispartoflocationAIST Tsukuba, Japan
dc.rights.retentionY
dc.subject.fieldofresearchMicrotechnology
dc.subject.fieldofresearchcode091009
dc.titleEnvironment Friendly MEMS Process
dc.typeConference output
dc.type.descriptionE3 - Conferences (Extract Paper)
dc.type.codeE - Conference Publications
gro.date.issued2011
gro.hasfulltextNo Full Text
gro.griffith.authorDao, Dzung V.


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    Contains papers delivered by Griffith authors at national and international conferences.

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