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  • Microprobing the Mechanical Effects of Varying Dielectric Porosity in Advanced Interconnect Structures

    Author(s)
    Hsing, Alexander
    Geisler, Holm
    Ryan, Vivian
    Chen, Ming
    Machani, Kashi
    Breuer, Dirk
    Lehr, Matthias
    Paul, Jens
    Iacopi, Francesca
    Dauskardt, Reinhold
    Griffith University Author(s)
    Iacopi, Francesca
    Year published
    2012
    Metadata
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    Abstract
    Chip-package interaction has become a major concern due to increasingly porous low-K dielectrics. During the packaging process, shear stresses are exerted on fragile interconnect structures. We use a microprobe metrology system to experimentally measure how interconnect stacks with different dielectric porosities behave under various shear loading conditions and a wide range of temperatures.Chip-package interaction has become a major concern due to increasingly porous low-K dielectrics. During the packaging process, shear stresses are exerted on fragile interconnect structures. We use a microprobe metrology system to experimentally measure how interconnect stacks with different dielectric porosities behave under various shear loading conditions and a wide range of temperatures.
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    Conference Title
    2012 IEEE International Interconnect Technology Conference (IITC 2012) Proceedings
    DOI
    https://doi.org/10.1109/IITC.2012.6251666
    Subject
    Numerical Modelling and Mechanical Characterisation
    Publication URI
    http://hdl.handle.net/10072/53562
    Collection
    • Conference outputs

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