Microprobing the Mechanical Effects of Varying Dielectric Porosity in Advanced Interconnect Structures
Author(s)
Hsing, Alexander
Geisler, Holm
Ryan, Vivian
Chen, Ming
Machani, Kashi
Breuer, Dirk
Lehr, Matthias
Paul, Jens
Iacopi, Francesca
Dauskardt, Reinhold
Griffith University Author(s)
Year published
2012
Metadata
Show full item recordAbstract
Chip-package interaction has become a major concern due to increasingly porous low-K dielectrics. During the packaging process, shear stresses are exerted on fragile interconnect structures. We use a microprobe metrology system to experimentally measure how interconnect stacks with different dielectric porosities behave under various shear loading conditions and a wide range of temperatures.Chip-package interaction has become a major concern due to increasingly porous low-K dielectrics. During the packaging process, shear stresses are exerted on fragile interconnect structures. We use a microprobe metrology system to experimentally measure how interconnect stacks with different dielectric porosities behave under various shear loading conditions and a wide range of temperatures.
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Conference Title
2012 IEEE International Interconnect Technology Conference (IITC 2012) Proceedings
Subject
Numerical Modelling and Mechanical Characterisation