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dc.contributor.authorMarsi, Noraini
dc.contributor.authorMajlis, Burhanuddin Yeop
dc.contributor.authorHamzah, Azrul Azlan
dc.contributor.authorMohd-Yasin, Faisal
dc.date.accessioned2017-05-03T15:53:54Z
dc.date.available2017-05-03T15:53:54Z
dc.date.issued2013
dc.date.modified2014-04-15T22:26:26Z
dc.identifier.issn19918178
dc.identifier.urihttp://hdl.handle.net/10072/58476
dc.description.abstractCharacterization of ProTEXSB thin films of newly developed photosensitive layer as alternative replacement for silicon nitride or silicon oxide wet etch masks. ProTEXSB thin films have been deposited on Si/SiC wafer for bulk micromachining technology in MEMS capacitive pressure sensor diaphragm to obtain a new recipe process flow of various factor. In this paper, we will discuss the process flow for ProTEXSB deposition to estimate the final film thickness that is defined by the spin-coating rotational speed, final cure temperature and hard bake time of ProTEXSB coatings. ProTEXSB thin films have been preliminary characterized by infinite focus microscopy (IFM) and scanning electron microscopy (SEM) to examine the substrate surface conditions and the effects of undercut edges structure. Based on these results, it was determined the optimum thickness of ProTEXSB is 2.133 孠with the spin speed of 3000 rpm. The recommended for the first bake temperature of 110 àin 120 seconds and for the second bake temperature of 240 àin 60 seconds. ProTEXSB can withstand the etch mask with etch rate of 1.28 孯min for 8 hours and gives good quality effect of undercut edge on Si/SiC wafer.
dc.description.peerreviewedYes
dc.description.publicationstatusYes
dc.format.extent248143 bytes
dc.format.mimetypeapplication/pdf
dc.languageEnglish
dc.language.isoeng
dc.publisherINSInet Publications
dc.publisher.placePakistan
dc.publisher.uriHttp://www.ajbasweb.com/
dc.relation.ispartofstudentpublicationY
dc.relation.ispartofpagefrom315
dc.relation.ispartofpageto319
dc.relation.ispartofissue12
dc.relation.ispartofjournalAustralian Journal of Basic and Applied Sciences
dc.relation.ispartofvolume7
dc.rights.retentionY
dc.subject.fieldofresearchMicroelectromechanical Systems (MEMS)
dc.subject.fieldofresearchMicroelectronics and Integrated Circuits
dc.subject.fieldofresearchcode091306
dc.subject.fieldofresearchcode090604
dc.titleInvestigation of ProTEX PSB Thin Film as Photosensitive Layer for MEMS capacitive pressure sensor diaphragm based Si/SiC Wafer
dc.typeJournal article
dc.type.descriptionC1 - Articles
dc.type.codeC - Journal Articles
gro.rights.copyright© 2013 INSInet. The attached file is reproduced here in accordance with the copyright policy of the publisher. Please refer to the journal's website for access to the definitive, published version.
gro.date.issued2013
gro.hasfulltextFull Text
gro.griffith.authorMohd-Yasin, Faisal


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