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  • Holey Silicon as an Efficient Thermoelectric Material

    Author(s)
    Tang, Jinyao
    Wang, Hung-Ta
    Lee, Dong Hyun
    Fardy, Melissa
    Huo, Ziyang
    P. Russell, Thomas
    Yang, Peidong
    Griffith University Author(s)
    Huo, Ziyang
    Year published
    2010
    Metadata
    Show full item record
    Abstract
    This work investigated the thermoelectric properties of thin silicon membranes that have been decorated with high density of nanoscopic holes. These "holey silicon" (HS) structures were fabricated by either nanosphere or block-copolymer lithography, both of which are scalable for practical device application. By reducing the pitch of the hexagonal holey pattern down to 55 nm with 35% porosity, the thermal conductivity of HS is consistently reduced by 2 orders of magnitude and approaches the amorphous limit. With a ZT value of 0.4 at room temperature, the thermoelectric performance of HS is comparable with the best value ...
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    This work investigated the thermoelectric properties of thin silicon membranes that have been decorated with high density of nanoscopic holes. These "holey silicon" (HS) structures were fabricated by either nanosphere or block-copolymer lithography, both of which are scalable for practical device application. By reducing the pitch of the hexagonal holey pattern down to 55 nm with 35% porosity, the thermal conductivity of HS is consistently reduced by 2 orders of magnitude and approaches the amorphous limit. With a ZT value of 0.4 at room temperature, the thermoelectric performance of HS is comparable with the best value recorded in silicon nanowire system.
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    Journal Title
    Nano Letters
    Volume
    10
    Issue
    10
    DOI
    https://doi.org/10.1021/nl102931z
    Copyright Statement
    Self-archiving of the author-manuscript version is not yet supported by this journal. Please refer to the journal link for access to the definitive, published version or contact the authors for more information.
    Subject
    Physical Chemistry of Materials
    Publication URI
    http://hdl.handle.net/10072/61522
    Collection
    • Journal articles

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