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  • Integration of PDMS and PMMA for Batch Fabrication of Microfluidic Devices

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    96076_1.pdf (223.1Kb)
    Author(s)
    Tan, His Yin
    Loke, Weng Keong
    Nam-Trung, Nguyen
    Griffith University Author(s)
    Nguyen, Nam-Trung
    Year published
    2010
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    Abstract
    Polydimethylsiloxane (PDMS) finds its use in a wide range of microfluidic applications due to its flexibility and low cost . Poly(methyl methacrylate) (PMMA) attracts growing interest in microfluidics research community due to its low cost, high transparency, good mechanical and chemical properties. Combining PMMA with PDMS allows a high degree of flexibility in designing microfluidic devices. Bonding of PMMA to PDMS is a critical step for this hybrid approach. We present here a novel technique for bonding PMMA to PDMS. This technique is simple, fast and reliable. A dry adhesive layer was laminated onto the PMMA substrate. ...
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    Polydimethylsiloxane (PDMS) finds its use in a wide range of microfluidic applications due to its flexibility and low cost . Poly(methyl methacrylate) (PMMA) attracts growing interest in microfluidics research community due to its low cost, high transparency, good mechanical and chemical properties. Combining PMMA with PDMS allows a high degree of flexibility in designing microfluidic devices. Bonding of PMMA to PDMS is a critical step for this hybrid approach. We present here a novel technique for bonding PMMA to PDMS. This technique is simple, fast and reliable. A dry adhesive layer was laminated onto the PMMA substrate. A pre-cured PDMS mixture was spin coated onto the adhesive to form a PDMS membrane. The bonding quality and the strength of the PDMS/adhesive membrane was tested using a precision pressure source. The results show that the bond can hold a pressure up to 20 kPa.
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    Conference Title
    6TH WORLD CONGRESS OF BIOMECHANICS (WCB 2010), PTS 1-3
    Volume
    31
    Publisher URI
    https://link.springer.com/book/10.1007/978-3-642-14515-5
    DOI
    https://doi.org/10.1007/978-3-642-14515-5_298
    Copyright Statement
    © 2010 Springer Berlin/Heidelberg. This is the author-manuscript version of this paper. Reproduced in accordance with the copyright policy of the publisher.The original publication is available at www.springerlink.com
    Subject
    Engineering practice and education not elsewhere classified
    Publication URI
    http://hdl.handle.net/10072/61730
    Collection
    • Conference outputs

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