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  • A planar fractal micro‑transformer with air core and hilbert curve

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    Accepted Manuscript (AM)
    Author(s)
    Zhu, Yong
    Khan, Fahimullah
    Lu, Junwei
    Dao, Dzung Viet
    Griffith University Author(s)
    Lu, Junwei
    Zhu, Yong
    Dao, Dzung V.
    Year published
    2015
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    Abstract
    In this paper, a novel MEMS-based planar fractal transformer is presented. Space-filling property of Hilbert curve is exploited for the miniaturization of integrated transformers. Compared to traditional spiral transformer, the fractal Hilbert transformer requires only one metal layer and no interconnection vias or cross-overs, thereby reducing micro-fabrication complexity, EMI interference and resistive loss in the cross-overs. The transformer is implemented in a low-cost MetalMUMPs standard process. The transformer is coreless and the silicon underneath the primary and secondary coils is removed to mitigate the parasitic ...
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    In this paper, a novel MEMS-based planar fractal transformer is presented. Space-filling property of Hilbert curve is exploited for the miniaturization of integrated transformers. Compared to traditional spiral transformer, the fractal Hilbert transformer requires only one metal layer and no interconnection vias or cross-overs, thereby reducing micro-fabrication complexity, EMI interference and resistive loss in the cross-overs. The transformer is implemented in a low-cost MetalMUMPs standard process. The transformer is coreless and the silicon underneath the primary and secondary coils is removed to mitigate the parasitic capacitance. The dc resistance of the transformer is 0.78 O, and the primary inductance of 9.3 nH has been obtained at 30 MHz. The quality factor of the transformer at 60 MHz is 1.6 and the total area of the transformer is 0.27 mm2. The obtained inductance density of 35 nH/mm2 is better than other air core transformers thus far in the literature.
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    Journal Title
    Microsystem Technologies
    DOI
    https://doi.org/10.1007/s00542-014-2253-1
    Copyright Statement
    © 2014 Springer Berlin Heidelberg. This is an electronic version of an article published in Microsystem Technologies, August 2015, Volume 21, Issue 8, pp 1691–1695. Microsystem Technologies is available online at: http://link.springer.com/ with the open URL of your article.
    Subject
    Microelectronics
    Microelectromechanical systems (MEMS)
    Communications engineering
    Nanotechnology
    Publication URI
    http://hdl.handle.net/10072/63788
    Collection
    • Journal articles

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