Top-Down Nanomachining of Metals
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Micro- and nanomachining technologies are commonly categorized into top-down and bottom-up approaches. Making nanoscale structures using top-down approach has been facing difficulties due to the limitation of optical lithography and the low throughput of electron beam and ion beam techniques. Soft lithography and hot embossing can transfer nanostructures across a large wafer. However, these techniques are limited to a soft substrate such as polymers only. A recent work by researchers from Purdue University, Harvard University, Madrid Institute for Advanced Studies, and the University of California, San Diego demonstrated a new embossing technology to create wafer-scale smooth threedimensional nanoshapes on hard crystalline metal.
Micro and Nanosystems
© 2014 Bentham Science Publishers. This is the author-manuscript version of this paper. Reproduced in accordance with the copyright policy of the publisher. Please refer to the journal website for access to the definitive, published version.
Microelectromechanical Systems (MEMS)