Top-Down Nanomachining of Metals

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Author(s)
Nguyen, NT
Griffith University Author(s)
Year published
2014
Metadata
Show full item recordAbstract
Micro- and nanomachining technologies are commonly categorized into top-down and bottom-up approaches. Making nanoscale structures using top-down approach has been facing difficulties due to the limitation of optical lithography and the low throughput of electron beam and ion beam techniques. Soft lithography and hot embossing can transfer nanostructures across a large wafer. However, these techniques are limited to a soft substrate such as polymers only. A recent
work by researchers from Purdue University, Harvard University, Madrid Institute for Advanced Studies, and the University of California, San Diego demonstrated a ...
View more >Micro- and nanomachining technologies are commonly categorized into top-down and bottom-up approaches. Making nanoscale structures using top-down approach has been facing difficulties due to the limitation of optical lithography and the low throughput of electron beam and ion beam techniques. Soft lithography and hot embossing can transfer nanostructures across a large wafer. However, these techniques are limited to a soft substrate such as polymers only. A recent work by researchers from Purdue University, Harvard University, Madrid Institute for Advanced Studies, and the University of California, San Diego demonstrated a new embossing technology to create wafer-scale smooth threedimensional nanoshapes on hard crystalline metal.
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View more >Micro- and nanomachining technologies are commonly categorized into top-down and bottom-up approaches. Making nanoscale structures using top-down approach has been facing difficulties due to the limitation of optical lithography and the low throughput of electron beam and ion beam techniques. Soft lithography and hot embossing can transfer nanostructures across a large wafer. However, these techniques are limited to a soft substrate such as polymers only. A recent work by researchers from Purdue University, Harvard University, Madrid Institute for Advanced Studies, and the University of California, San Diego demonstrated a new embossing technology to create wafer-scale smooth threedimensional nanoshapes on hard crystalline metal.
View less >
Journal Title
Micro and Nanosystems
Volume
6
Issue
3
Copyright Statement
© 2014 Bentham Science Publishers. This is the author-manuscript version of this paper. Reproduced in accordance with the copyright policy of the publisher. Please refer to the journal website for access to the definitive, published version.
Subject
Nanomanufacturing
Microelectromechanical Systems (MEMS)