Enhanced photoelectroctatlytic performance of etched 3C–SiC thin film for water splitting under visible light
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3C-SiC films have robust mechanical and physicochemical properties and a narrow band gap (2.36 eV). In this work, a robust p-type 3C-SiC thin film is grown on a large silicon substrate using a low temperature alternating supply epitaxy method. The film is heavily doped with Al in order to achieve high conductivity and allow photoelectrocatalytic splitting of water for hydrogen production under visible light. The as-grown thin film is further treated with a facile dry etching process in order to improve the surface area and induce a light trap structure. In comparison with the as-grown sample, the etched thin film possesses substantially improved photoelectrocatalytic performance due to increased light absorption, larger surface area and reduced recombination rate of photoelectron and holes.
© 2014 Royal Society of Chemistry. This is the author-manuscript version of this paper. Reproduced in accordance with the copyright policy of the publisher. Please refer to the journal website for access to the definitive, published version.
Solid State Chemistry