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  • A Novel Three-State Contactless RF Micromachined Switch for Wireless Applications

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    Accepted Manuscript (AM)
    Author(s)
    Pal, J
    Zhu, Y
    Lu, J
    Khan, F
    Dao, D
    Griffith University Author(s)
    Lu, Junwei
    Zhu, Yong
    Dao, Dzung V.
    Year published
    2015
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    Abstract
    This letter presents a novel three-state contactless radio frequency (RF) microelectromechanical systems switch for wireless applications. The switch is free from stiction and charge injection issues occurred inherently in contact-type RF MEMS switches, thereby increasing reliability and lifetime. The contactless switch is based on variable capacitance between signal lines and movable grounded electrodes controlled by electrostatic actuator. The movable grounded electrode has the capability to move bidirectionally, and therefore, the switch can change among ON-, OFF-, and deep OFF-states. Thus, additional isolation can be ...
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    This letter presents a novel three-state contactless radio frequency (RF) microelectromechanical systems switch for wireless applications. The switch is free from stiction and charge injection issues occurred inherently in contact-type RF MEMS switches, thereby increasing reliability and lifetime. The contactless switch is based on variable capacitance between signal lines and movable grounded electrodes controlled by electrostatic actuator. The movable grounded electrode has the capability to move bidirectionally, and therefore, the switch can change among ON-, OFF-, and deep OFF-states. Thus, additional isolation can be achieved in the deep OFF-state. The RF measurement results show that the contactless switch has a capacitance tuning ratio of 5.25 between OFF- and ON-states, and a higher tuning ratio of 11.18 between deep OFF- and ON-states. In addition, the switch exhibits -3.62 dB insertion loss and -24.43 dB isolation at 2.4 GHz. At 5 GHz, the insertion loss and isolation are -2.95 dB and -20.65 dB, respectively.
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    Journal Title
    IEEE Electron Device Letters
    Volume
    36
    Issue
    12
    DOI
    https://doi.org/10.1109/LED.2015.2487510
    Copyright Statement
    © 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
    Subject
    Microelectronics
    Microelectromechanical systems (MEMS)
    Publication URI
    http://hdl.handle.net/10072/99196
    Collection
    • Journal articles

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