Global-Aware External Attention Deep Model for Sequential Recommendation

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Wang, T
Wang, C
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Kashima, Hisashi

Ide, Tsuyoshi

Peng, Wen-Chih

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2023
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Osaka, Japan

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Abstract

The sequential recommender plays a major role in contemporary recommendation systems, which shows the strong ability to model sequential patterns among the dataset. The classic sequential recommenders utilize the convolutional neural network, recurrent neural network, and self-attention mechanism to model the user’s preferences of items. However, these existing sequential recommendation models face the “Filter Bubble” issue by putting too much attention on each user’s own historical sequence, and they also ignore the feature-level item-item relationship. To address the existing challenges, we propose a novel global-aware external attention deep model (EDM) to learn both the global and local user preferences. The proposed EDM mainly contains a multi-embedding layer, an external attention layer, a feature-wise feed-forward network, and the candidate matching layer. Specifically, the external attention layer uses two external memory units shared across the entire input set to model the global interests of users. Then, by applying the feed-forward network to each feature dimension, the feature-wise feed-forward network is capable to learn the feature-level dependencies and properly model the local user preferences. In the experiments, three benchmark datasets are used with various validation metrics to show that our proposed EDM outperforms the state-of-the-art methods.

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Advances in Knowledge Discovery and Data Mining: 27th Pacific-Asia Conference on Knowledge Discovery and Data Mining, PAKDD 2023, Osaka, Japan, May 25–28, 2023, Proceedings, Part III

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13937

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Data mining and knowledge discovery

Information and computing sciences

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Wang, T; Wang, C, Global-Aware External Attention Deep Model for Sequential Recommendation,Advances in Knowledge Discovery and Data Mining: 27th Pacific-Asia Conference on Knowledge Discovery and Data Mining, PAKDD 2023, Osaka, Japan, May 25–28, 2023, Proceedings, Part III, 2023, 13937, pp. 335-347