Environment Friendly MEMS Process

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Author(s)
Dao, Dzung Viet
Nakamura, Koichi
Amikura, M.
Ota, R.
Morikawa, Y.
Ohara, J.
Asami, K.
Sugiyama, Susumu
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Ruytaro Maeda

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2011
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AIST Tsukuba, Japan

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Abstract

This work presents our recent research and development of environment-friendly MEMS fabrication technology based on an eco-friendly silicon deep reactive ion etching (D-RIE), and polymer-MEMS utilizing hot embossing process. In order to show the capability of this 'Green' fabrication technology, several typical MEMS devices have been fabricated successfully.

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Technical Digest of International Workshop on Green Devices and Micro Systems (GDMS 2011)

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Microtechnology

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