Measurement of Plasma Etch Damage by a New Slow Trap Profiling Technique
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Author(s)
Tanner, P
Dimitrijev, S
Yeow, YT
Harrison, HB
Dimitrijev, S
Yeow, YT
Harrison, HB
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1996
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383808 bytes
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IEEE Electron Device Letters
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17
Issue
11
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© 1996 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
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Forestry biomass and bioproducts
Electronics, sensors and digital hardware