A New Approach to Explore the Surface Profile of Clay Soil Using White Light Interferometry
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Liu, Junwei
Xu, Longfei
Zhang, Mingyi
Jeng, Dong-Sheng
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Abstract
In order to have a better understanding of the real contact area of granular materials, the white light interference method is applied to explore the real surface morphology of clay soils under high stress. Analysis of the surface profile indicates that there exists a support point height z0 with the highest distribution frequency. A concept of a real contact region (from z0 to z0 + d90; d90 represents the particle size corresponding to 90% of the volume fraction) is proposed by combining a surface profile with the particle size distribution of clay soil. It was found that under the compressive stress of 106 MPa–529 MPa, the actual contact area ratio of clay soil varies between 0.375 and 0.431. This demonstrates an increasing trend with the rise of stress. On the contrary, the apparent porosity decreases with an increasing stress, varying between 0.554 and 0.525. In addition, as the compressive stress increases, the cumulative frequency of apparent profile height (from z0 − d90 to z0 + d90) has a concentrated tendency with a limited value of 0.9.
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Sensors
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20
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11
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© 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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Analytical chemistry
Ecology
Soil sciences
Science & Technology
Physical Sciences
Chemistry, Analytical
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Yang, S; Liu, J; Xu, L; Zhang, M; Jeng, D-S, A New Approach to Explore the Surface Profile of Clay Soil Using White Light Interferometry, Sensors, 2020, 20 (11), pp. 3009