Fabrication methods for SU-8 optical interconnects in plastic substrates
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Fickenscher, Thomas
O'Keefe, Steven G
Thiel, David V
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Abstract
Buried optical interconnects promise high speed interconnections between electronic circuits on circuit boards. Previous attempts have relied on expensive microfabrication technologies and complex optical coupling systems. The circuits in plastic (CiP) manufacturing method has electronic components embedded in a plastic substrate making direct optical coupling possible. Four different machining methods were used to create optical waveguides in polymethyl methacrylate (PMMA) substrate and with SU8 channel, covered with a thin sheet of PMMA. A three-layer milling technique showed least attenuation (1.17 and 1.20 dB/cm at 1310 and 1550 nm, respectively). The technique shows significant promise for low cost fabrication of CiP with optical interconnects.
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IEEE Photonics Technology Letters
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26
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13
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© 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
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Atomic, molecular and optical physics
Photonic and electro-optical devices, sensors and systems (excl. communications)
Communications engineering