The humidity, temperature, wind speed/direction micro sensors can be manufactured individually, resulting in three individual substrates. The integration of the three sensors into a single substrate is a vital challenge to achieve an integrated intelligent sensor so called a multiple sensor. This requires the integration of process flows and is a major challenge because adequate sensor performance must be maintained. Polyimide was selected as a humidity sensing material for its compatibility with conventional integrated circuit fabrication technology, negligible temperature dependence and good resistance against contamination. Nickel was selected for the temperature and wind speed/direction sensor because of its useful temperature coefficient and the advantage of its cost. Since the known wet etchant for nickel requires hard-baked photoresist, a method which does not attack the polyimide while removing the photoresist must be developed. The method developed for etching nickel employs hard-bake-free photoresist. Other challenge was ensuring good thermal isolation for the wind speed/direction sensor fabricated on a silicon nitride layer preformed on top of a silicon wafer. Since silicon acts as a good heat sink, the silicon under the sensor was etched entirely away until the silicon nitride layer was reached. This structure achieved good thermal isolation resulting in small power consumption. This low power feature is essential for sensors deployed in fields where power access or replacement of power sources is restricted. This structure was compared with the structure created by polyimide plateau on a silicon nitride layer coated on a silicon substrate as a function of power consumption. Based on the examination of thermal isolation, the multiple sensor utilizing a MEMS technique was fabricated with a single-sided mask aligner. The characteristics of humidity sensors fabricated with polyimide were examined in detail with respect to variations of electrode structures, improvement of sensitivity, effect of process temperature, temperature and frequency dependence, and stability. The humidity sensor constructed with O2 plasma treated polyimide resulted an improvement in sensitivity and hysteresis. The investigation using XPS, FTIR and AFMconcluded the chemical modification of polyimide played an important role in this improvement. The design, fabrication and results of a series of humidity sensors are quantified. There is always no unique packaging solution for sensors because of the application-specific nature of the sensors. This intelligent environmental monitoring system was designed to accommodate both an environmental sensor and its signal conditioning electronics circuitry (SICONEC) into a single package. The environmental sensors need direct exposure to the environment while SICONEC needs a sealed encapsulation to avoid environmental damage. A new style of packaging addressing these requirements was demonstrated using a hot embossing machine. The hot embossing machine was used to embed an integrated circuit (IC) in a bare die condition into a polycarbonate (PC) sheet. In this case, the IC was flipped down against the PC, which protects the front side of the IC from the environmental damages. In a test phase, a die containing operational amplifiers was embossed into the PC. A humidity sensor and surface mount resisters were placed on the same surface of the PC to test the validity of this new technique. Interconnection between the embossed die and the humidity sensor was established using bonding wires. Copper tracks were also used to ensure all electrical connections for the die, the humidity sensor and the resistors. The results clarified the method developed. Details of process methods, issues and further potential improvement are reported.